22 Pages

L23

Course Number: EECS 247, Fall 2004

College/University: Berkeley

Rating:

Document Preview

Todays Lecture Decimation filters for ADCs Digital decimation filters Aliasing in the analog domain Aliasing in the digital domain Coefficient precision and gain scaling Digital arithmetic throughput calculations One-stage decimation Linear phase implications A/D DSP EECS 247 Lecture 23: Decimation Filters 2002 B. Boser 1 Analog-to-Digital Converters A Analog-to-Digital Converter ( ADC) combines...

Unformatted Document Excerpt
Coursehero >> California >> Berkeley >> EECS 247

Course Hero has millions of student submitted documents similar to the one
below including study guides, practice problems, reference materials, practice exams, textbook help and tutor support.

Course Hero has millions of student submitted documents similar to the one below including study guides, practice problems, reference materials, practice exams, textbook help and tutor support.

Lecture Todays Decimation filters for ADCs Digital decimation filters Aliasing in the analog domain Aliasing in the digital domain Coefficient precision and gain scaling Digital arithmetic throughput calculations One-stage decimation Linear phase implications A/D DSP EECS 247 Lecture 23: Decimation Filters 2002 B. Boser 1 Analog-to-Digital Converters A Analog-to-Digital Converter ( ADC) combines An analog modulator which produces an oversampled output stream of 1-bit digital samples A digital decimation filter which takes the 1-bit modulator output as its input and Filters out out-of-band quantization noise Filters out unwanted out-of-band signals present in the modulators analog input Lowers the sampling frequency to a value closer to 2X the highest frequency of interest A/D DSP EECS 247 Lecture 23: Decimation Filters 2002 B. Boser 2 ADCs Commercial DSPs arent designed to handle 1-bit input samples at oversampled data rates A 400Mip DSP only executes 133 instructions per 3MHz sample In 2001, the 32X32b multiply-accumulate cost is 5/Mip, independent of the number of active bits/word (ref. 1) DSPs are designed to handle 16+ bit wide data words at Nyquist-like sampling frequencies decimation filters bridge the speed/resolution gap A/D DSP EECS 247 Lecture 23: Decimation Filters 2002 B. Boser 3 Aliasing in the Analog Domain Well continue using the 3MHz, 1-bit modulator and its audio application as the basis for decimation filter analysis Sampling action at the modulator input inherently results in alia...
L23

Textbooks related to the document above:

Find millions of documents on Course Hero - Study Guides, Lecture Notes, Reference Materials, Practice Exams and more. Course Hero has millions of course specific materials providing students with the best way to expand their education.

Below is a small sample set of documents:

Berkeley - EECS - 247
Todays Lecture Modeling the ADC decimation filter Decimated DFTs Fixed and floating point comparisons Troubleshooting and test modes Multistage decimation filters Parks-McClellan filters Manual decimators Hogenauer filters Half-band filter
Berkeley - EECS - 247
Data Receivers Digital data receivers Equalization Data detection Timing recovery NRZ data spectra Eye diagrams Transmission line response Think of it as another example for a 247 project A/D DSPEECS 247 Lecture 25: Digital Data Receive
Berkeley - EECS - 247
Equalization Isolated pulse responses Pulse spreading Group delay variation Equalization Magnitude equalization Phase equalization The Comlinear CLC014 Equalizer Equalizer bandwidth and noise Bit error probabilitiesA/D DSPEECS 247 Lect
Berkeley - EECS - 247
Offset Control Offset control in data receivers dc offset ac coupling Baseline wander Quantized feedback Decision circuitsA/D DSPEECS 247 Lecture 27: Offset Control 2002 B. Boser 1Equalizer Gainh1(s)=s/(s+p1) vIN 0.21 vOUTh2(s)=s/
Berkeley - EECS - 122
EE122 Socket Programming Project (Version 5.0) Spring 20051ObjectiveYou will implement the client side of a simple le-transfer application based on a receiever-oriented TCP-like protocol (c.f. Section 2) over UDP. The project is based on WebTP
Berkeley - EECS - 122
EE122 Socket Programming Project ReportThe nal design report is due on Thursday, May 5, 2005. Your report should include the following information: 1. A one page description of your implemented API. List the main functions with a list of their argu
Berkeley - IS - 213
Appendix B Interview SummaryInterviewee #1 Demographics Male 25 years old Single No kids Graduate Student Interviewee #2 Interviewee #3 Interviewee #4 Interviewee #5 Interviewee #6 Demographics Female 28 years old In a relationship No kids PhD Stud
Berkeley - IS - 213
An online photo organization and retrieval systemwww.photocat.org Is213-photocat@sims.berkeley.eduCarrie Burgener carrie@simsScott Fisher sbfisher@simsAndrea Nelson andrea@sims Mike Wooldridge mikew@simsPresentation Overview Project
Berkeley - IS - 213
Vern Group Assignment: Heuristic EvalHeuristic Evaluation of SIMS Alumni Network Project UI1. Reports:1, Heuristic:HELP, Severity:2 On the login page, the Sign Up Now! link should be highlighted to draw attention to itself as a link 2. Reports:1,
Berkeley - IS - 213
ID 1 2 3# of ReportsHeuristic Severity 1 HELP 1 MATCH 2 CONSTDescription 2 On the login page, the "Sign Up Now!" link should be highlighted to draw attention to itself as a link 1 On the login page, the submit button really should be labelled "
Berkeley - EECS - 252
University of California College of Engineering Department of Electrical Engineering and Computer ScienceJ. M. Rabaey K. KeutzerTuTh2-3:30pmCS 252: Spring 00 Quiz 1Due Monday March 13 at 10am. Either at Reception of 231 Cory or by e-mail to ja
Berkeley - EECS - 252
Abbreviated Quiz1 Solution: 1. Explain the utility of each of the following DSP architectural features. Demonstrate with the aid of a simple specific example (described in pseudo-code). Circular Buffers o Automatic hardware mechanism does automatic p
Berkeley - EECS - 252
SID 12365409 12381754 12394388 12405871 12410725 12451083 12565336 12684335 12752580 12828422 13016674 13086460 13325212 13651930 13738360 13738377 13738926 13739657 13749421 13971351 14138120 14141334 14142881 14170442 14181423 14574679 14575299 145
Berkeley - EECS - 252
University of California College of Engineering Department of Electrical Engineering and Computer ScienceJ. M. Rabaey K. KeutzerTuTh2-3:30pmCS 252: Spring 00 Quiz 2Due Monday April 17 at 10am. Either at Reception of 231 Cory or by e-mail to ja
Berkeley - EECS - 252
12365409 12381754 12394388 12405871 12410725 12451083 12565336 12684335 12752580 12779108 12828422 12955517 13016674 13086460 13325212 13512966 13651930 13738360 13738377 13738926 13739657 13765436 13971351 14138120 14141334 14141421 14142881 1417044
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. Boser Homework 1 Due Thursday, January 18, 2007 NTU 247 Spring 2007Note: You need to show zoom-in plots of your filter response
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. Boser Homework 2 Due Thursday, February 1, 2007 NTU 247 Spring 20071. Design a filter with the following response:s( s2 + 9.83
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. Boser Homework 3 Due Monday, February 19, 2007 NTU 247 Spring 2007!1. A full-scale sine wave with frequency f x = 7MHz is inpu
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. Boser Homework 4 Due Monday, March 19, 2007 NTU 247 Spring 20071. The graph below shows a histogram of the output codes obtained
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. Boser Homework 5 Due Monday, April 2, 2007 NTU 247 Spring 20071. Download the datasheet of the AD7677 A/D converter from www.ana
Berkeley - EECS - 247
UNIVERITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences NTU 247 B. E. BOSER Reference Chi-Hung Lin, and Klaas Bult, A 10-b, 500-MSamples/s CMOS DAC in 0.6mm2, IEEE Journal of Solid-State Circuit, vol.
Berkeley - EECS - 143
Undergraduate IC-MEMS Processing LaboratoryIntroduction and HistoryThe EECS 143 undergraduate course Processing and Design of Integrated Circuits has been designed to familiarize students with fabrication technology, types of device structures, ele
Berkeley - EECS - 143
The TA Manual for EE143Documentation from Fall 2002 Revision #0Table of ContentsThe TA Manual for EE143 . 1 Table of Contents.. 2 Preface/Motivation of Documentation. 3 Head TAs responsibilities:.. 4 Lab TAs responsibilities:. 5 TA Weekly Checkl
Berkeley - EECS - 143
College of Engineering Department of Electrical Engineering and Computer Sciences University of California, Berkeley Below are your weekly quizzes. You should print out a copy of the quiz and complete it before your lab section. Bring in the complete
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #3 Quiz-Active Area DefinitionName _ Section _ Date _ (1) How does spin speed and time affect photoresist application?(2) What is the purpose of t
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #4 Quiz-Gate OxidationName _ Section _ Date _ (1) What is the purpose of the furnace tube TCA step?(2) Why do we run an additional "control" wafer
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #6 Quiz-Gate DefinitionName _ Section _ Date _ (1) Assuming perfect alignment, please draw a top view of what the overlapping alignment markers will
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #7 Quiz-Source/DrainName _ Section _ Date _ (1) What is the purpose of the spin-on glass (SOG)?(2) Why is the timing of the pre-diffusion step impo
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #8 Quiz-Contact CutName _ Section _ Date _ (1) What layer will we be cutting through today?(2) What etchant (and what concentration) will we be usi
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #9 Quiz-MetallizationName _ Section _ Date _ (1) Draw a schematic diagram of the vacuum system, in the detail given in the lab manual. (label all com
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #10 Quiz-Metal DefinitionName _ Section _ Date _ (1) At what temperature is the aluminum etchant kept? Why can't the aluminum etchant be used at room
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #11 Quiz-CharacterizationName _ Section _ Date _ (1) What is Metrics and what is it used for?(2) What is a HP-4145 and what can it measure?(3) Ho
Berkeley - EECS - 143
Department of Electrical Engineering and Computer Sciences University of California, BerkeleyWeek #12 QuizMEMS Processing & CharacterizationName _ Section _ Date _(1) Unlike MOSFET fabrication where we removed PR of METL layer to prepare for sin
Berkeley - EECS - 143
Fabrication Process Flow:Week 2: Field Oxidation - 5200 AWeek 3: Active Area PhotolithographyWeek 4: Gate Oxidation - 800 AWeek 5: Poly-Si DepositionWeek 6: Gate PhotolithographyWeek 6: Clear Source and DrainWeek 7a: Source-Drain Deposit
Berkeley - EECS - 143
1NMOS Fabrication Process DescriptionModified by Alex Chediak on March 2000. Modified by TAs team (Eric Hobbs, Paul Hung, Paul Friedberg, Min She) in Fall semester, 2002.Part 1) A checklist: what do you need in EE143 lab and microlab?At the beg
Berkeley - EECS - 143
Furnace process tips: 1. When removing the end cap from tube, push it back straightly. If it is stuck to the tube, move it slightly up and down. (Always put on insulating gloves since it is very hot.) You can also apply this process tip to the cylind
Berkeley - EECS - 143
EE143 MEMS DevicesGeneral Comments: MEMS devices were fabricated in the identical process as you performed in the EE143 lab. A XeF2 etch was performed as the last step, to remove some of the Si substrate and free the oxide structures. The structures
Berkeley - EECS - 143
MEMS in EE143Why are MEMS being incorporated into the EE143 mask set?Because MEMS constitute a growing field which has spawned from the robust and widespread microfabrication industry. Many traditional integrated circuit corporations are now invest
Berkeley - EECS - 143
Lab Report 1 Table of Contents1. Profiles & Layout (14 Points) 2. Process Procedures (30 points) 3. Calculations (26 Points) 4. Questions (30 Points) 5. Bonus Questions (10 Points)Total Points = 110 possible (graded out of 100)Please be sure to i
Berkeley - EECS - 143
Metrics TutorialTable of Contents1. 2. 3. 4. 5. 6. 7. Introduction The Set-Up Editor The Project File Manager Data Windows Plot Windows Exporting and Importing Data Linking Metrics and Excel1. IntroductionThe software package, Metrics, can be us
Berkeley - EECS - 143
Device CharacterizationTable of Contents1. Line Width and Misalignment Measurements: (Test Structures 1a, 1b) 2. Resistors: (Test Structures 2a-2b and 2c-2d) 3. Capacitors: (Test Structures 3, 4, 5) 4. Diode: (Test Structure 7) 5. MOSFET: (Test Str
Berkeley - EECS - 143
Tips for Capacitance MeasurementMeasurement set-up:On the source setup page for the CMH source be sure to select the Cp-Q capacitance model (for our values of capacitance this gives better readings than a series model). Also, be sure to choose a ca
Berkeley - EECS - 143
Summary of MOSFET ParametersParameter tox (gate) Measured/Extracted Theoretical UnitsC (gate) oxND NA xD CFB QSS (Qf)eff L (linear)Vt (field oxide) Vt L=4 L=6 L=8 L=10 W=10 W=15 W=20 k L=4 L=6 L=8 L=10 W=10 W=15 W=20
Berkeley - EECS - 143
Lab Report 2Table of Contents1. 2. 3. 4. 5. Measurements (20 points) Parameter Extraction (30 points) Calculations (35 points) Discussion (15 points) MEMS discussion (5 points)TOTAL = 100 points (+ 5 points)This report will summarize characteriz
Berkeley - EECS - 143
Safety, Cleaning, and Chemical Disposal Procedures1. Using AcidsAt many points in the fabrication process strong acids are used as etchants. These cause severe burns if kept in contact with your skin for more than a few seconds, and will cause blin
Berkeley - EECS - 143
Using Vernier ScalesVernier scales allow us to resolve alignment errors much more acurately than the minimum feature size for agiven process. To gain this fine resolution, they depend on accurately spaced lines. The picture on the left is a close re
Berkeley - EECS - 143
. Etch Rates for Micromachining and IC Processing (A/min) v. 4.4 29 July 1996 U.C. Berkeley Microfabrication Laboratory / Berkeley Sensor & Actuator Center / Kirt R. Williams The top etch rate was measured by the author with fresh solutions, clean ch
Berkeley - EECS - 143
EE143XeF2 etch tutorialSpring 2000 TAsXeF2 Etching of Silicon Characteristics: dry, isotropic, vapor-phase etch XeF2 sublimates at its vapor pressure (~3.8 Torr at 25 C) to etch silicon. Important: Wafer surfaces need to be dehydrated immediate
Berkeley - EECS - 143
Laboratory EquipmentProcessing 1 Headway Research Inc. Model EC101 Photoresist Spinner 1 Thermolyne Type 1900 Hot Plate, controlled by Omega CN76000 temperature controller 1 Model HP-A1915B Hot Plate Oven, one Model OV-10600 Hot Plate O
Berkeley - EECS - 143
Kasper Mask Aligner Manual1. IntroductionThe Kasper Wafer Alignment System is an integrated optical-mechanical, pneumatic-electrical system which allows accurate alignment of sensitized semiconductor wafers with a mask and exposes them to ultraviol
Berkeley - EECS - 143
NanoSpec Manual1. BackgroundThe NanoSpec is an instrument for measuring the thickness of optically transparent thin (10 to 4000 nm) films on silicon wafers. The basic operating principle is that the intensity of monochromatic reflected light depend
Berkeley - EECS - 143
Four-Point Probe Manual1. IntroductionThe purpose of the 4-point probe is to measure the resistivity of any semiconductor material. It can measure either bulk or thin film specimen, each of which consists of a different expression. The derivation w
Berkeley - EECS - 143
Description of a Basic Vacuum SystemFigure 1: Configuration of a basic vacuum system. The system, illustrated in Figure 1, contains the essential elements typically required to obtain high vacuum. The most common and reliable systems utilize three
Berkeley - EECS - 143
Cory 218 Aluminum Thermal Evaporator(ATE) 1.0 TitleAluminum thermal evaporator (ATE) in Cory 2182.0 Purpose:This document has specific information about the aluminum thermal evaporator in Cory 218 to help EE143 TAs and students understand its sa
Berkeley - EECS - 143
SUPREM SSUPREM3 and TSUPREM-4 are licensed products, and use is restricted to students in EECS courses at UCB. SSUPREM3:o o o o o o o o o o o o o o o o o o o o o o o o oSSUPREM3 is licensed software from Silvaco International. Please see /usr/pub/
Berkeley - EECS - 143
TSUPREM4 Process Simulation Results for EE143 MOSFET DeviceFall 2002In courtesy of Daewon HaEE143 MicrofabricationWeek 1, Fall 2002Initial 3 <100> WFSi substrateEE143 MicrofabricationWeek 1, Fall 2002Boron Implantation (11B, 3.0x101
Berkeley - EECS - 143
SIMPL Manual1. GETTING STARTED RUNNING SIMPLIn order to run SIMPL on Ara, you need to have an account on the Ara/Cory cluster. If you are running the software directly from the host workstation (e.g. in 111 Cory), you can skip to Section III. If yo
Berkeley - EECS - 143
SAMPLE TUTORIALBarry Paul Linder, Spring 1996.IntroductionSAMPLE is a simulation package that mimics a real processing laboratory. The machines SAMPLE simulates include an Exposure machine, a Developer machine, an E-beam machine, an Ion-beam mach
Berkeley - EECS - 143
N.CHEUNGEE143, Fall 2005 Homework Assignment #1 (Due September 15, 9:40am in class)Required Reading 1)Introduction to Microengineering by Danny Bank in EE143 Reader 2) Streetman, Chap 3, Energy bands and charge carriers in semiconductors in EE143
Berkeley - EECS - 143
N.CHEUNG Homework Assignment # 2 (Due 9/22 Th, 9:40pm) Reading Assignments 1) Chapter 3 of Jaeger on Thermal Oxidation 2) EE143 Reader Chapter 9 of Mayer and Lau on Thermal Oxidation.EE143, Fall 2005*There will be discrepancy in xox , B, and B/A
Berkeley - EECS - 143
N.CHEUNG Homework Assignment #3 (Due Sept 29, Th, 9:40pm) Reading Assignment 1) Chapter 5 of Jaeger on Ion Implantation [Overview] 2) 143Reader : Chapter by Mayer and Lau on Ion Implantation [mechanisms] 3) 143 Reader Projected Range and Straggle dat