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chapter1-introduction01

Course: MR 310, Spring 2010
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Integrated Digital Circuits YuZhuo Fu contact:fuyuzhuo@ic.sjtu.edu.cn Office location417 room WeiDianZi building,No 800 DongChuan road,MinHang Campus 1.Introduction If the automobile had followed the same development cycle as the computer, a RollsRoyce would today cost $100, get one million miles to the gallon and explode once a year outline Course Introduction A brief history Design Metrics MOS...

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Integrated Digital Circuits YuZhuo Fu contact:fuyuzhuo@ic.sjtu.edu.cn Office location417 room WeiDianZi building,No 800 DongChuan road,MinHang Campus 1.Introduction If the automobile had followed the same development cycle as the computer, a RollsRoyce would today cost $100, get one million miles to the gallon and explode once a year outline Course Introduction A brief history Design Metrics MOS transistor CMOS logic Semiconductor processing DIC characteristics Design partitioning Example: a simple MIPS microprocessor 1. Introduction 3 course instruction Course namedDigital Integrated Circuit Course codeSOME-021 Course typefundamental credit68 hours4 credits 2011/2/24 4 Textbook Digital integrated circuit Jan M.Rabaey CMOS VLSI design- a circuits and systems perspective Meil H.E.Weste, addison wesley press Reference Computer organization and design, john.l.hennessy CMOS IC layout, dan clein Reuse Methodology manual for system-on-chip designs, Michael Keating 2011/2/24 5 Method of course Time, location 120 weeks Wed.1-2[8:00AM-9:40AM], Room 409 Fri.3-8[10:00AM-11:40], Room409 materials slides Please pre-read the slides before the lessons Do not note the materials which slides have Download address Ic.sjtu.edu.cn/ 6 exam () 45 6 4 () 5 6 4 () 8 4 Office Hours (/) 3 6*3=18 4*3=12 3*3=9 3 3*3=12 3 2 1 1 18 24 7 Lab assistant teacherprof. yuzhuo fu contact:fuyuzhuo@ic.sjtu.edu.cn Office location417 room Office hours:Weds 15:30PM-16:30PM, Fri. 15:30PM16:30PM microelectronic building,No 800 DongChuan road,MinHang Campus predigital logic, circuit basic Lab assistant: Jiaojiajia@ic.sjtu.edu.cn weidianzi blds 2th floor Office hours: 8 target Understanding the basic principle of Digital IC Inverter analysis Combinational logic Sequential logic Clocking issues Wire and interconnection issues Datapath design Skills SPICE layout 2011/2/24 9 what is this book all about? Introduction to digital integrated circuits. CMOS devices and manufacturing technology. CMOS inverters and gates. Propagation delay, noise margins, and power dissipation. Sequential circuits. Arithmetic, interconnect, and memories. Programmable logic arrays. Design methodologies. What will you learn? Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, and reliability 10 Why digital circuits ? Design and implement the module libraries Critical timing path still need circuit design Some technologies tend to be pushed to its limit need circuit design Abstraction-based approach is only correct to a certain degree, such as interconnect parasitics, etc Scaling tends to emphasize some other deficiencies of the abstraction-based model New design issues and constraints tend to emerge over time Model not always show the truth 11 Some references http://www.itrs.net/ http://www.lib.sjtu.edu.cn(IEEE conferences and journals) IEEE Journal of Solid-State Circuits (JSSC) IEEE International Solid-State Circuits Conference(ISSCC) Symposium on VLSI Circuits (VLSI) 12 outline Course Introduction a brief history Design Metrics MOS transistor Semiconductor processing DIC characteristics Design partitioning/CMOS logic Example: a simple MIPS microprocessor 0: Introduction Slide 13 The First Computer The babbage difference engine(1832) 25,000 parts cost: 17,470 [1] The Babbage Pages http://www.ex.ac.uk/BABBAGE/ [2] J. A. N. Lee http://ei.cs.vt.edu/~history/Babbage.html [3] Charles Babbage Institute http://www.cbi.umn.edu/charles.htm [4] Howard Rheingold Tools For Thought http://www.rheingold.com/texts/tft/index.html [5] Ada http://www.cs.yale.edu/homes/tap/Files/ada-lovelace-notes.html [6] Dr. Betty Toole Ada http://www.cs.yale.edu/homes/tap/Files/ada-bio.html [7] [9] 2011/2/24 14 ENIAC - The first electronic computer (1946) http://www.seas.upenn.edu/~museum/ John Mauchly and J. Presper Eckert 15 Current fastest computer in the world 2011/2/24 16 The Transistor Revolution William Shockley John Bardeen T-R-A-N-S-I-S-T-O-R Resistor which can amplify electrical signals as they are transferred 2011/2/24 Walter Brattain First transistor Bell Labs, 1948 17 The First Integrated Circuits No vacuum, no filament, no glass tube but cold 2011/2/24 18 Greatest persons Jack S.Kilby(1923-2005) William Shockley(1910-1989) Robert Noyce1927-1990 Greatest persons 09IC11243.7% 0.3%[Gartner] 200941.59 200834.1121.93% 10% 21 $24M $0.3 80M 23 $40 $15 Shopkeeper $8 Logitech $14 Device Vendors $3 Total Manufacturing 24 Moores Law In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months. He made a prediction that semiconductor technology will double its effectiveness every 18 months 25 1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975 LOG2 OF THE NUMBER OF COMPONENTS PER INTEGRATED FUNCTION Moores Law 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Electronics, April 19, 1965. 2011/2/24 26 Transistor Counts 1 Billion Transistors K 1,000,000 100,000 10,000 1,000 i486 i386 80286 100 10 Pentium III Pentium II Pentium Pro Pentium 8086 Source: Intel 1 1975 1980 1985 1990 1995 2000 2005 2010 Courtesy, Intel 2011/2/24 Projected 27 Moores law in Microprocessors Transistors (MT) 1000 2X growth in 26 months)! 100 10 486 1 386 286 0.1 0.01 P6 Pentium proc 8086 8080 8008 4004 8085 0.001 1970 1980 1990 Year 2000 2010 Courtesy, Intel Transistors on Lead Microprocessors double every 2 years 2011/2/24 28 Die Size Growth Die size (mm) 100 10 8080 8008 4004 1 1970 8086 8085 1980 386 286 P6 Pentium proc 486 ~7% growth per year ~2X growth in 10 years 1990 Year 2000 2010 Courtesy, Intel Die size grows by 14% to satisfy Moores Law 2011/2/24 29 Frequency Frequency (Mhz) 10000 Doubles every 2 years 1000 100 486 10 8085 1 0.1 1970 8086 286 P6 Pentium proc 386 8080 8008 4004 1980 Courtesy, Intel 1990 Year 2000 2010 Lead Microprocessors frequency doubles every 2 years 2011/2/24 30 Power Dissipation Power (Watts) 100 P6 Pentium proc 10 8086 286 1 8008 4004 486 386 8085 8080 Courtesy, Intel 0.1 1971 1974 1978 1985 Year 1992 2000 Lead Microprocessors power continues to increase 2011/2/24 31 Power will be a major problem 100000 18KW 5KW 1.5KW 500W Power (Watts) 10000 1000 100 Pentium proc 286 8086 386486 10 8085 8080 8008 1 4004 0.1 1971 1974 1978 1985 1992 2000 2004 2008 Courtesy, Intel Year Power delivery and dissipation will be prohibitive 2011/2/24 32 Power density Power Density (W/cm2) 10000 1000 100 Rocket Nozzle Nuclear Reactor 8086 10 4004 Hot Plate P6 8008 8085 Pentium Intel Power proc 386 286 486 8080 1 1970 1980 1990 2000 2010 Year Courtesy, density too high to keep junctions at low temp 2011/2/24 33 Not Only Microprocessors Cell Phone Small Signal RF Digital Cellular Market (Phones Shipped) Power RF Power Management 1996 1997 1998 1999 2000 Units 48M 86M 162M 260M 435M Analog Baseband Digital Baseband (DSP + MCU) (data from Texas Instruments) 2011/2/24 34 10,000 10,000,000 1 00,000,000 100,000 Logic Tr./Chip Tr./Staff Month. 1,000 1,000,000 1 0,000,000 10,000 100 100,000 Productivity (K) Trans./Staff - Mo. Complexity Logic Transistor per Chip (M) Productivity Trends 1 ,000,000 1,000 58%/Yr. compounded Complexity growth rate 1 10,0000 1 00,000 100 1 1,000 1 0,000 10 x 0.1 100 xx 0.01 10 xx x 1 1,000 21%/Yr. compound Productivity growth rate x x 0 00 1.1 00 1.01 Courtesy, ITRS Roadmap 2009 2007 2005 2003 2001 1999 1997 1995 1993 1991 1989 1987 1985 1983 1981 0.001 1 Source: Sematech Complexity outpaces design productivity 2011/2/24 35 Why Scaling? Technology shrinks by 0.7/generation With every generation can integrate 2x more functions per chip; chip cost does not increase significantly Cost of a function decreases by 2x But How to design chips with more and more functions? Design engineering population does not double every two years Hence, a need for more efficient design methods Exploit different levels of abstraction 2011/2/24 36 Technology Strategy / Roadmap 37 Design Abstraction Levels SYSTEM MODULE + GATE CIRCUIT DEVICE G S n+ 2011/2/24 D n+ 38 outline Course Introduction a brief history Design Metrics MOS transistor Semiconductor processing DIC characteristics Design partitioning/CMOS logic Example: a simple MIPS microprocessor 0: Introduction Slide 39 Design Metrics How to evaluate performance of a digital circuit (gate, block, )? Cost Reliability Scalability Speed (delay, operating frequency) Power dissipation Energy to perform a function 2011/2/24 40 Cost of Integrated Circuits NRE (non-recurrent engineering) costs design time and effort, mask generation one-time cost factor Recurrent costs silicon processing, packaging, test proportional to volume proportional to chip area 2011/2/24 41 NRE Cost is Increasing 2011/2/24 42 Die Cost Single die Wafer Going up to 12 (30cm) From http://www.amd.com 2011/2/24 43 Design Economics Non-recurring engineering costs(NREs) Recurring costs Fixed costs Ctotal Stotal = (1-m) Ctotal is the manufacturing cost of a single IC to the vendor M is the desired profit margin 44 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Engineering design cost Etotal Prototype manufacturing cost Ptotal The NRE costs can be amortized over the lifetime volume of the chips 45 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Ftotal= Etotal + Ptotal Engineering design cost Etotal Prototype manufacturing cost Ptotal The NRE costs can be amortized over the lifetime volume of the chips 46 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Engineering design cost Etotal The cost of designing the IC Etotal hopefully will happen once during the chip design process Personnel cost Architectural design Logic capture Simulation for functionality Layout of modules and chip Timing verification DRC and tapout procedures Test generation 47 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Engineering design cost Etotal The cost of designing the IC Etotal hopefully will happen once during the chip design process Support costs Computer costs CAD software costs Education or re-education costs 48 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Engineering design cost Etotal The cost of designing the IC Etotal hopefully will happen once during the chip design process Costs reference(2010) Salary $50-$100K Overhead $10-$30K Computer costs $2K CAD software costs Digital $10K Analog $100K Back end $1M 49 Non-recurring engineering costs Spent once during the design of integrated circuit Ftotal Ftotal= Etotal + Ptotal Engineering design cost Etotal Prototype manufacturing cost Ptotal The mask costs($500K-$1M for 130nm process) Test fixture costs($1K-$50K) Package tooling MPW is an economical way of prototype(MOSIS) 50 An example of NRE You are starting a company to commercialize your brilliant research idea. Estimate the cost to prototype a mixed-signal chip. Assume you have 7 digital designers. 3 analog designers and 5 support personnel and that the prototype takes 2 fabrication runs and 2 years Digital designers:7*($70K+$30K+$10K+$10K)=$840K Analog designers:3*($100K+$30K+$10K+$100K)=$720K Support personnel:5*($40K+$20K+$10K)=$350K 2 fabrication:$2M Total:$4*2M=$8M 51 Design Economics Non-recurring engineering costs(NREs) Recurring costs Fixed costs C total Stotal (1 m) Ctotal is the manufacturing cost of a single IC to the vendor M is the desired profit margin 52 Recurring costs Rtotal=Rprocess+Rpackage+Rtest Rprocess process cost Rprocess=W/(N.Yw.Ypa) W=wafer cost($500-$3000) depending on process and wafer size N= gross die per wafer Yw=die yield wafer(should be 70%-90% for moderate sized dice in a mature process) Ypa=packaging yield (should be 95%-99%) 53 Yield No. of good chips per wafer Y 100% T otal number of chips per wafer Wafer cost Die cost Dies per wafer Die yield Wasted area around the edges of a circular wafer wafer diameter/2 2 wafer diameter Dies p er wafer die area 2 die area 54 Design Economics Non-recurring engineering costs(NREs) Recurring costs Fixed costs Once a chip has been designed and put into manufacture, the cost to support that chip from an engineering viewpoint may face a few sources Data sheets___characteristics Application notes 55 An example of NRE Suppose your startup seeks a return on investment of 5, the wafers cost $2000 and hold 400 gross die with a yield of 70%. If packaging, test and fixed costs are negligible. How much do you need to charge per chip to have a 60% profit margin? How many chips do you need to sell to obtain a 5-fold return on your $8M investment Rtotal=Rprocess=2000/(400*0.7)=$7.14 Chip are sold at $7.14/(1-0.6)=$17.86 Profit per unit is $17.86-$7.14=$10.72 8M*5/10.72=3.73M(assuming 1.5 year lifetime, 3.73/1.5*12=207K/month) 56 We were strong 300mm wafer and Pentium 4 IC. 0: Introduction 57 Photos courtesy of Intel. We were strong 58 What should we know Reading some history Moores Law NRE Cost 59 What should we know Reading some history Moores Law NRE Cost 60
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University of Auckland - COMPSCI - 101
COMPSCI 101THE UNIVERSITY OF AUCKLANDSECOND SEMESTER, 2002Campus: City and TamakiCOMPUTER SCIENCETESTPrinciples of Programming(Time allowed: 75 minutes)NOTE:Attempt ALL questions.Write your answers in the space provided.There is space at the ba
University of Auckland - COMPSCI - 101
COMPSCI 101THE UNIVERSITY OF AUCKLANDSECOND SEMESTER, 2002Campus: City and TamakiCOMPUTER SCIENCETESTPrinciples of Programming(Time allowed: 75 minutes)NOTE: Attempt ALL questions.Write your answers in the space provided.There is space at the ba
University of Auckland - COMPSCI - 101
CompSci 101 SS CTHE UNIVERSITY OF AUCKLANDSummer School, 2003City CampusCOMPUTER SCIENCEPrinciples of Programming(Time allowed: TWO HOURS)Surname:Forenames:Student ID number:Login name (UPI):INSTRUCTIONS:Attempt ALL questions - write your answ
University of Auckland - COMPSCI - 101
CompSci 101 SS CTHE UNIVERSITY OF AUCKLANDSummer School, 2003City CampusCOMPUTER SCIENCEPrinciples of Programming(Time allowed: TWO HOURS)Surname:Forenames:Student ID number:Login name (UPI):INSTRUCTIONS:Attempt ALL questions - write your answ
University of Auckland - COMPSCI - 101
CompSci 101 SS C Terms Test 2003Answers to question 1, 2, 10 and 11QUESTION 1a)b)c)d)e)f)g)h)5.0Total = 51.5Total = " + 5 + 1.5n\\n10097int rand = (int)(Math.random() * 50) * 2) + 1;System.out.println(rand);QUESTION 24 syntax errors:
University of Auckland - COMPSCI - 101
C ompSci 1 01 S S CTHE UNIVERSITY OF AUCKLANDSUMMER SCHOOL, 2003COMPUTER SCIENCEPrinciples of ProgrammingTERMS TEST(Time allowed: 75 MINUTES)Surname:Forenames:Student ID number:Login name (UPI):INSTRUCTIONS:Attempt ALL questions - write your a
University of Auckland - COMPSCI - 101
CompSci 101 S1 CTHE UNIVERSITY OF AUCKLANDFirst Semester, 2003City CampusCOMPUTER SCIENCEPrinciples of Programming(Time allowed: TWO HOURS)Surname:Forenames:Student ID number:Login name (UPI):INSTRUCTIONS:Attempt ALL questions - write your ans