Unformatted text preview: That makes a polished silicon wafer. 2. Describe how small features (lines, holes, etc.) are made in integrated circuits. By using photolithography, one can use insulating layer to structure the circuit components. The photoresist toughens the wanted designs. Metallization is where the bonds are created on the integrated circuits. 3. Boron is a common dopant (impurity) in silicon. If a typical silicon wafer with a diameter of 300 mm and a thickness of 0.7 mm were to contain 1 x 10 17 boron atoms per cm 3 , how many grams of boron is in the wafer? 1.795 x 10 –5 Grams of boron...
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- Fall '05
- Ion implantation, Czochralski process, Silicon dioxide, Zone melting