HW_3 - ECE 432 Introduction to MEMS Homework 3(Due in class...

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ECE 432 Introduction to MEMS Sunil Bhave Homework 3 (Due in class on Monday, 9/17/2007) Fall 2007 1. Cadence Tutorial Complete the Cadence tutorial at to fabricate a hinged plate Indicate which masks are light field and which are dark field
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2. MUMPS Process Flow The layout of a lateral resonator shown below is sent to the MUMPS foundry to be fabricated The MUMPS film thicknesses are: Silicon nitride 0.6 µm POLY0 0.5 µm Oxide1 2 µm DIMPLE depth 0.75 µm POLY1 2 µm Oxide2 0.75 µm POLY2 1.5 µm METAL 0.5 µm
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3. Thin Film Stress Upon release of the structure in problem 1, the 200 µm long suspension beams expand 0.15 µm to completely relieve their stress. If the Young’s modulus of the POLY1 layer was 190 GPa as-deposited, answer the following: a) Was POLY1 under compressive or tensile stress? b) What is the value of the residual stress? 4. Processing The above figure from Senturia is a clear conceptual illustration of a surface micromachining process, but it is somewhat lacking in practicality.
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