Lec03-PWB Assembly-Ch17

Lec03-PWB Assembly-Ch17 - PWB Assembly (Ch 17) Process of...

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PWB Assembly (Ch 17)    components onto PWB.
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Component Types Surface Mount: smaller, lighter, low cost use less “real estate” (board space) fewer holes to be drilled simpler automated assembly Through-Hole: large and heavy components large currents
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Dual In Line Through-Hole
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Lead Styles Size Lead shape (Gull wing, J lead, butt or I lead, solder ball) Leads allow components on both sides of board, close Common Package Shapes  SOIC, Small Outline IC PLCC, Plastic Leaded Chip Carrier QFP, Quad Flat Pack BGA, Ball Grid Array Signal Path Symmetry Improved electrical performance (high speed apps) Surface Mount ICs
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Gull Wing Lead
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J lead & I lead or Butt lead
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Gull Wing
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BGA & PGA (Pin Grid Array)
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Surface Mount Discrete Components Common Package Sizes: 0402 0603 0805 1206 0805 = 80mils X 50mils, L X W (mil = thousandths of an inch)
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This note was uploaded on 04/24/2008 for the course IME 156 taught by Professor Perks during the Winter '07 term at Cal Poly.

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Lec03-PWB Assembly-Ch17 - PWB Assembly (Ch 17) Process of...

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