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Lec03-PWB Assembly-Ch17

Lec03-PWB Assembly-Ch17 - PWB Assembly(Ch 17 Process of...

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PWB Assembly (Ch 17)    Process of mounting & soldering  components onto PWB.
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Component Types Surface Mount: smaller, lighter, low cost use less “real estate” (board space) fewer holes to be drilled simpler automated assembly Through-Hole: large and heavy components fasteners & connectors large currents
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Dual In Line Through-Hole
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Lead Styles Size Lead shape (Gull wing, J lead, butt or I lead, solder ball) Leads allow components on both sides of board, close Common Package Shapes  SOIC, Small Outline IC PLCC, Plastic Leaded Chip Carrier QFP, Quad Flat Pack BGA, Ball Grid Array Signal Path Symmetry Improved electrical performance (high speed apps) Surface Mount ICs
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SOT & SOIC Gull Wing Lead
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SOIC & PLCC J lead & I lead or Butt lead
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TSOIC (Thin SO) & QFD Gull Wing
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BGA & PGA (Pin Grid Array)
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Surface Mount Discrete Components Resistors, capacitors & inductors Common Package Sizes: 0402 0603 0805 1206 0805 = 80mils X 50mils, L X W (mil = thousandths of an inch)
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