lec6_design_of_four_chip_module

lec6_design_of_four_chip_module - Design of a Four Chip...

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Design of Four Chip Module Design of a Four Chip Module Ref: Class and Project Notes
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Design of Four Chip Module MEM 1 DSP RF CHIP Mixed Signal Mixed Signal Four Chip Module (FCM) Four Chip Module (FCM) Three different types of chips in this MCM Digital Signal Processor (DSP) RFIC Two memory chips ( MEM1 and MEM 2) Each chip is flip-chip mounted with different area arrays : Memory chips have an array of 100 pads DSP has 150 pads RF Chip has 50 pads The Package is a Ball Grid Array (BGA), again with 100 pads. Implementation of this FCM leads to reduction in pin count from 400 to 100 exiting the package FCM consists of 3 digital ICs ( MEM1, MEM2 and DSP) and 1 RFIC MEM 2 Die 1 Die 2 Die 3 Die 4 Package
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Design of Four Chip Module Various Control and Data Buses Various Control and Data Buses on the FCM on the FCM
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Design of Four Chip Module Mixed signal FCM Mixed signal FCM MEM 1 MEM 2 DSP RF CHIP Main data/control buses are indicated here Netlist is provided 16 Bit Data Bus (DA and DB) 8 Bit Address Bus –Multidrop (A) 6 Bit RF Control Pins from the DSP (RF) Data A  (DA) Data B (DB) RF A
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Design of Four Chip Module RF CHIP Common Clock Architecture – H Tree Common Clock Architecture – H Tree Clock frequency for the digital ICs - 400 MHz FCM uses common clock architecture This clock is supplied from outside the package, and has to be routed to each digital chip (MEM1, MEM2 and DSP) using an H-Tree routing scheme shown in class MEM1 MEM 2 DSP Clock pins on each of the digital ICs Clock Pin on the BGA package
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Design of Four Chip Module FCM : Control Signals for each chip FCM : Control Signals for each chip MEM 1 MEM 2 DSP RF CHIP 6 Bit DSP Control Lines to each Memory IC 6 6 14 bit RF Bus 9 ctrl lines 9 ctrl lines 5 ctrl lines Control signals from each chip routed to the BGA – these signals have to be connected between the pads of each IC and the BGA pads on the FCM package
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Design of Four Chip Module MEM 1 DSP RF CHIP Electromagnetic BandGap (EBG) Electromagnetic BandGap (EBG) Structure Structure FCM consists of 3 digital ICs ( MEM1, MEM2 and DSP) and 1 RFIC RFIC supports : Global Positioning System
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This note was uploaded on 04/28/2008 for the course ECE 4460 taught by Professor Swaminathan during the Spring '08 term at Georgia Tech.

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lec6_design_of_four_chip_module - Design of a Four Chip...

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