lec21_thermal_mgmt_mod

# lec21_thermal_mgmt_mod - Fundamentals of Thermal Management...

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Fundamentals of Thermal Management Fundamentals of Thermal Management Ref: Chap 6, Fundamental of Microelectronics Packaging, Edited by Rao Tummala

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Fundamentals of Thermal Management Example of A Chip Package with A Heat Sink Example of A Chip Package with A Heat Sink
Fundamentals of Thermal Management Equivalent Thermal Resistance for the Chip Package Equivalent Thermal Resistance for the Chip Package R (heat sink) = 1 K/W Si Die: 1cm x 1cm; 1mm thick k (Si) = 120 W/mK Package Size: 2cm x 2cm; 5mm thick k (mold material) = 0.8 W/mK Package dissipation = 2W Thermal interface material: 0.2mm thick k (thermal material) = 1.5 W/mK Air gap (between package & PWB) = 0.1mm thick k (air) = 0.026 W/mK Thermal conduction through leads assumed negligible Ambient air temperature = 45C Calculate value of die temperature ? R (PWB to air) = 10 K/W R j1 =0.08333 K/W (Si Die) R ja1 =R jb +R b3 +R 34 +R 4a =36.3 K/W R 12 =R jb =10 K/W (mold compound) R ja2 =R j1 +R 12 +R 2s +R sa =11.4 K/W R 2s =0.3333 K/W (thermal grease) R equiv =R ja1 ||R ja2 =8.7 K/W R b3 =9.62 K/W T j =qR equiv + T a = 62.3 C R 34 =6.663 K/W

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Fundamentals of Thermal Management Heat Removal Methods Heat Removal Methods
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