lec20_heat_transfer_thermal_resistance

lec20_heat_transfer_thermal_resistance - Heat Transfer and...

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Heat Transfer and Thermal Resistance Heat Transfer and Thermal Resistance Ref: Chap 6, Fundamental of Microelectronics Packaging, Edited by Rao Tummala
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Heat Transfer and Thermal Resistance What is Thermal Management ? What is Thermal Management ? Resistance to the flow of heat through the leads, poly-silicon layers and transistors comprising a semiconductor device results in significant heat generation within the operating microelectronic component. In the absence of cooling, the temperature of the component can rise causing the failure of the component. Placing the device in contact with a lower temperature solid/fluid facilitates heat flow away from the component. This is called thermal management for the device. Why Thermal Management ? Why Thermal Management ? Without thermal management, the device/component/package can have catastrophic failures (it can melt).
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Heat Transfer and Thermal Resistance Effect of Temperature on Failure Rate Effect of Temperature on Failure Rate
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Heat Transfer and Thermal Resistance Thermal Thermal Management Management Techniques for Techniques for Various Packaging Various Packaging Levels Levels Packaging Level Passive Cooling Techniques Active Cooling Techniques IC Package – Level 1 High conductivity Adhesive, Greases, Phase Change Materials, High Conductivity molding compound, Heat Spreader, Heat Slug, Heat Sinks, Dielectric Liquid Immersion, Heat Pipes Air jet impingement, Dielectric liquid PWB – Level 2 Thick power and ground planes, Insulated metal substrates, Heat Pipes, Natural convection Fans, Dielectric liquids, Cold plates Module and rack – Level 3 Natural Convection, Heat Pipes Air Handling, Cold Plates, Refrigeration systems
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Heat Transfer and Thermal Resistance Roadmap for Semiconductor Packages – An Example Roadmap for Semiconductor Packages – An Example Year 1999 2001 2003 2006 2012 Cost/Perf Power (W) Chip Size (mm2) Heat Flux (W/cm2) On-Chip Freq (MHz) Junction Temperature (C) Ambient Temperature (C) Pin Count 48 340 13.5 526 100 45 300-976 61 385 15.8 727 100 45 352-895 75 430 17.4 928 100 45 413-1093 96 520 18.5 1108 100 45 524-1476 109 750 14.5 1827 100 45 846-2690
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lec20_heat_transfer_thermal_resistance - Heat Transfer and...

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