chapter last miss farah background - PRINTED CIRCUIT BOARDS PREPARED BY NUR FATHIN BINTI SANUSI 2013429438 NUR ALYA AMIRAH BINTI ROSLI 2013807864 NUR

chapter last miss farah background - PRINTED CIRCUIT BOARDS...

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PRINTED CIRCUIT BOARDS NUR FATHIN BINTI SANUSI 2013429438 NUR ALYA AMIRAH BINTI ROSLI 2013807864 NUR FARAHIN BINTI MOHAMED JAMIN 2013245776 RABIATULADAWIYAH BINTI ABD PREPARED BY:
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outliNe 1) Introduction to Printed Circuit Board (PCB) Definition and Terminologies Process Steps in Creating PCB: The CORE Patterning Vias Pattern Plating Solder Mask Surface Finish Silk Screening Process Steps of Two Layer PCB Multilayer PCB Process Steps of Four Layer PCB 2) PCB CAD GERBER Drill data Drawing Design for Manufacturability
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outliNe 3) Assembly Technology: Through-hole technology Surface mount technology: Solder Paste Application Component placement Soldering Wave Soldering Reflow Soldering Cleaning Repair/ Rework & Inspection Circuit Properties of PCB: Transmission Line Microstrip Line Stripline Coplanar Transmission Line
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PCB INTORDUCT IONS
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PRINTED CIRCUIT BOARD Printed Circuit Board (PCB) is structure that mechanically support and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components such as capacitors, resistors or active devices are generally soldered on the PCB
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PRINTED CIRCUIT BOARD The core Patternin g Vias Pattern Plating Solder Mask Surface Finish Silk Screenin g
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Pcb The Core Base element of PCB Consist of two sheets of thin copper laminated to an insulating material’ Insulating material which called the “substrate” or “laminate” Comes in large sheet : 18” x 24” Core Conductors: Copper is commonly used conducting material Thickness sheet is specified by term of weight in ounces per square foot ” The sheet also called as foil
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Pcb The Core Core Insulators: Behaviour: Cost, dielectric constant, electrical and mechanical performance. Typically reinforced with a weave of fibre Common dielectric use in industry is Fire Retardant Epoxy #4 (FR4)
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PCB PATTERNING PHOTOENGRAVING/ PHOTOLITOGRAPHY Chemical process PCB MILLING Mechanical process
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Photolithography/ photoengraving Printing a design pattern onto a translucent material create a photomask A photosensitive material will cover the core by photosensitive film or photoresist The properties of photosensitive material will changed when exposed to light A light source will exposed to the core through the photomask The photosensitive material is developed using a solution which make it soluble PCB PATTERNING
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Photolithography/ photoengraving The “now soluble” photosensitive material is removed by the etching solution when applied to the core, in addition of foil beneath it.
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  • Printed circuit board, PCB milling, solder mask

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