CH1-introduction_roadmap

CH1-introduction_roadmap - IH2655 Design and...

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Unformatted text preview: IH2655 Design and Characterisation of Nano- and Microdevices Introduction and technology roadmap Introduction and technology roadmap IH2655 SPRING 2009 Mikael stling KTH Course PM Subject: Advanced course of the physical and technological concepts used in modern CMOS and bipolar/BiCMOS fabrication. Prerequisites: Semiconductor Devices (IH1611) or Semiconductor Theory and Device Physics (IH2651) or equivalent knowledge in semiconductor device physics. Course content: 26 h lectures week 3-10 (see Daisy schedule). Approximately 8 h laboratory exercises (2 labs), to be scheduled in groups of 4. IH2655 SPRING 2009 Mikael stling KTH Course PM contd Lecturer: Prof. Mikael stling, Department of Microelectronics and Applied Physics, Solid State Devices, School of ICT, KTH, Campus Kista. E-mail: ostling@kth.se , phone: 08-790 4301 Two lectures will be given by Prof. Carl-Mikael Zetterling E-mail: bellman@kth.se , phone: 08-790 4344 and Dr Gunnar Malm, gunta@kth.se , 08-7904332 Laboratory exercises are with Dr Gunnar Malm and Valur Gudmundsson, same department. Literature: Plummer, Deal and Griffin, Silicon VLSI Technology: Fundamentals, Practice and Modeling . Prentice-Hall 2000, ISBN 0-13- 085037-3. (725 kr THS Bookstore in Kista) Examples from other VLSI books and journal articles Language: English Examination: Two written lab reports on time and 1 h Oral examination. Signup sheets for labs and exam circulate at the lectures. NOTE: LAB REPORTS ARE DUE ONE WEEK AFTER THE LAB! IF YOUR LAB REPORT IS LATE YOUR MAXIMUM GRADE IS E IH2655 SPRING 2009 Mikael stling KTH Schedule Reserve time (prel no lecture) 15-17 5-mar 15 Nanostructures / nanophysics 439 10-12 3- mar 14 Process integration: MOS and Bipolar 439 15-17 26-feb 13 Thin film deposition / Back-end processing 439 10-12 24-feb 12 Process and device simulation. (C-M Zetterling) Can be skipped if you have passed IH2653 (2B1248) 439 15-17 19-feb 11 Microlithography 439 10-12 17-feb 10 Electrical characterization. (Gunnar Malm) 439 15-17 12-feb 9 LPCVD of dielectrics and polysilicon Dry etching. 439 10-12 10-feb 8 Annealing (FA & RTA) Diffusion and ion implantation 439 15-17 05-feb 7 Thermal oxidation of silicon 439 10-12 03-feb 6 No lecture 439 15-17 29-jan 5 Wafer clean and wet processing 439 10-12 27-jan 4 Screening Silicon Run DVD: fabrication process (C-M Zetterling) 439 15-17...
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CH1-introduction_roadmap - IH2655 Design and...

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