Lecture_12_BEOL - Lecture 12 Metallization Back-end...

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Metallization / Back-end technology (BEOL) Lecture 12
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IH2655 Spring 2009 Mikael Östling KTH BEOL in VLSI: Interconnects and dielectrics Multi-level metallizations: (VLSI p415) 6-7 wiring levels in 0.18/0.13 μ m CMOS For yr 2010, up to 9 wiring levels for 0.07 μ m Cu metallization with etched off dielectrics, IBM 1997
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