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Unformatted text preview: the energy collected. Determine the photo-resist, and etching technology you are going to use. Draw the design of the masks which you are going to use to implement the etch process. Be sure that all of the structures are connected to the front contact. 3) Front contact- Design the front contact process. Draw the design of the mask. Estimate the contact resistance for the front contact. 4) Ion implantation-Ion implantation is to be used to form the n+ region of the contact. Design the thickness of the n+ region, design the ion implantation protocol (. How will you implement this patterned contact. What trade offs or limitations due the ion implantation impose on 2). Design the ion implantation mask, energy of implantations and dose. Design the annealing time and temperature. 5) Process sequence-Determine which order you will do 1-4 and the potential impacts...
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This note was uploaded on 04/04/2009 for the course ECE 5360 taught by Professor Shealy during the Fall '07 term at Cornell University (Engineering School).
- Fall '07