ECE_5360_Lab__7 - Lab #7 The Final Fabrication Step Today,...

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Lab #7 – The Final Fabrication Step Today, you will complete the fabrication of the devices you’ve been working on all semester. In the second half of class, you will begin to measure the electrical properties of the devices you’ve made. You will finish these measurements next week. 1. Ohmic Anneal - Rapid Thermal Anneal (RTA): a. Background: The RTA (Rapid Thermal Annealer) consists of a number of high-power feedback-controlled halogen lamps in a quartz-lined, water-cooled process chamber. This configuration is used to heat the wafers placed in the chamber to very high and precisely controlled temperatures, with very small temperature ramp up/down times, for the activation of dopants and contacts. For this lab, we will use the RTA to activate the Al ohmic contacts to the source/drain regions, in a process called sintering. The ohmic anneal lowers the contact resistance between the source/drain metallization and the degenerately doped ion implanted regions. It also improves the adhesion of the metal to
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ECE_5360_Lab__7 - Lab #7 The Final Fabrication Step Today,...

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