ECE_5360_Lab__8 - Lab # 7.5/ 8 - Device Measurements Part...

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Lab # 7.5/ 8 -- Device Measurements Part I: Resistors, TLMs, Diodes, and MOSFETs Having completed your fabrication process with the final anneal earlier this afternoon, you will bring your wafers to a probe station in the Phillips Hall Semiconductor Test Lab (Room 236). Make whatever measurements you have time for today, and finish up the rest next week. Lab Preparation:(prior to entering lab) 1. Anticipate the signals (sign and magnitude) which need to be applied to your devices’ terminals for reasonable test results. 2. Field Layout: The field layout with device numbering is given in Figure 2. Figure 2. Label convention for devices on the field layout.
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Lab Experiment: 1. Obtain Wafer from the TA: Place wafer in a carrier provided by the TA. 2. Probe Station Operation: Background a. Needle probes attached to micro-manipulators will allow the precise placement of probes on the devices’ probe pads. During movement of any manipulator, you must view what is going on under the microscope, or damage can result to the probes and/or the devices on your wafer. A successful probe job always leaves a mark on the probe pad - so you will notice scratches on the pads of any device that has been tested. You may also notice the effects of the anneal under the microscope as you contact areas in the probe station. The probes are attached to source measurement units (SMUs), which allow programable current/voltage testing of each device. Each station has 2 independent SMUs, called SMU1 and SMU2, attached to the yellow and orange tagged probes, respectively. The third probe, called GNDU, is tagged green and is connected to the common grounds of SMU1 and SMU2. b. Carefully review the instructions given below on the operation of probe stations in the measurement lab. It will help to examine the probe station controls, shown in Figure 3. Figure 3. Photograph of the Probe Station in the lab. The controls are highlighted. 1. Load Wafer : Verify that the probe tips are at least 2 mm above the wafer chuck. Slide your wafer carefully onto the chuck with tweezers provided.
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2. Position Wafer to the Desired Field : While viewing the wafer through the microscope, use the xy translators and rotation adjustment to position the wafer. Adjust the microscope focus so you see a clear image. Be sure you have selected the Blue objective (2.5x) to enlarge the field of view, and turn on the microscope illuminator. (Ask the TA for help if needed.) Continue adjusting the wafer position until one of the SMU Probes is directly over the desired probe pad. Once the wafer is in correct position under the probes, increase the magnification by switching to the other microscope objective (8x) on the turret, and refocus as necessary. Now, the SMU1 probe should be the upper left of the microscope’s field of view, while the SMU2 probe should appear in the lower left. The ground probe should be in the right portion of the microscope field of view. 3. Position Probes to Wafer’s Probe Pads
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This note was uploaded on 04/04/2009 for the course ECE 5360 taught by Professor Shealy during the Fall '07 term at Cornell University (Engineering School).

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ECE_5360_Lab__8 - Lab # 7.5/ 8 - Device Measurements Part...

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