ENGRI111_8_nanofab2 - ENGRI 111 Nanofabrication-2 Read...

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    ENGRI 111 ENGRI 111 Nanofabrication-2 Nanofabrication-2 Read Appendix E in Book
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    Metallization Metallization e www.tf.uni-kiel.de  
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    Metallization Metallization After source, drain and channel have been formed,  metallization is used to define electrodes  Low contact resistance (high for gate electrodes) Low electrical resistance along their path Stable during formation and under operating conditions Barrier layers sometimes necessary (Cu)
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    Contact Resistance Contact Resistance High free carrier concentration near surface No insulating layer present Interface chemically and mechanically stable Reactive metal forms the electrical contact A low resistance metal (Al, W, Cu) forms the bulk of  interconnect  A nor-reactive barrier metal such as TiN stabilizes the  interface between the two metals
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    Cross Section of Multilayer Metal Cross Section of Multilayer Metal Al TiN Ti Si SiO 2 SiO 2 Al Al Al
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ENGRI111_8_nanofab2 - ENGRI 111 Nanofabrication-2 Read...

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