Week-13-Metallization-I

Week-13-Metallization-I - EE-438L :Microelectronics...

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10/06/09 Dr. Kian Kaviani - Spring 2009 EE- 1 EE-438L :Microelectronics Processing Dr. Kian Kaviani Hsieh Ming Electrical Engineering Dept. University of Southern California Viterbi School of Engineering
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10/06/09 Dr. Kian Kaviani - Spring 2009 EE- 2 Metallization in IC Industry
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10/06/09 Dr. Kian Kaviani - Spring 2009 EE- 3 Applications of Metallization in IC Industry Ohmic Contacts (more than 2 Billions of them in a Pentium – 4 microprocessor chip) Schottky Contact (mostly in compound semiconductors as a replacement for the MOS structure, up to million of them in an state-of-the-art GaAs – based IC) Interconnects (Most commonly used application with many feet of them in a multi layer chip)
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10/06/09 Dr. Kian Kaviani - Spring 2009 EE- 4 Interconnects Speed and functional – density of Ics are limited by the interconnects. There are four limitations that interconnects can impose: 1. The minimum chip area can become interconnect – limited 2. The speed performance can be constrained by
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Week-13-Metallization-I - EE-438L :Microelectronics...

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