Week-16-Testing-assembly

Week-16-Testing-assembly - EE-438L :Spring 2009...

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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 1 EE-438L :Spring 2009 Microelectronics Processing Dr. Kian Kaviani Hsieh Ming Electrical Engineering Dept. USC Viterbi School Of Engineering
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 2 Testing Packaging & Assembly in IC Industry
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 3 IC Testing
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 4 IC Testing Philosophy of testing in IC industry: 1. Testing helps monitor the effectiveness of each process – step. 2. Testing identifies “good” (functional & reliable) Ics as well as those that are “bad”
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 5 IC Testing It is extremely important to to identify a defective IC in the early stags of its manufacturing. The cost of detecting and perhaps replacing a defective part increases dramatically at each stage of manufacturing an electronic system.
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 6 IC Testing Five stages of Testing of ICs:
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10/06/09 Dr. Kian Kaviani - Spring 2009, EE 7 Special Test Structures
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Dr. Kian Kaviani - Spring 2009, EE 8 Types of Measurements Examples of types of measurements made during the final parametric test include: Gate oxide breakdown voltage Drain – to – substrate breakdown voltage Drain – current for 0 V On – resistance of the gate MOSFET Transconductance at a specified operating – voltage Continuity and bridging in serpentine structures over oxide steps. Contact resistance of the contact hole and via strings
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This note was uploaded on 04/11/2009 for the course EE 438L taught by Professor Kaviani during the Spring '09 term at USC.

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Week-16-Testing-assembly - EE-438L :Spring 2009...

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