L15 lecture full - Coupling Mechanisms Interconnects Mostly...

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EECS 240 Lecture 15: Coupling and Isolation B. Boser 1 Coupling Mechanisms • Interconnects – Mostly capacitive – Distance helps – Isolation in time • Package (bond wires) • Supply • Substrate
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EECS 240 Lecture 15: Coupling and Isolation B. Boser 2 Package •L , M • dI/dt: beware of fast transients – Fast corner – Testing: cool chip! • Differential circuits • Orthogonal bond wires • Isolation with time
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EECS 240 Lecture 15: Coupling and Isolation B. Boser 3 Power Supply • Line / battery • Regulator • PCB Traces, decoupling • IC package • IC supply • Circuit block
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EECS 240 Lecture 15: Coupling and Isolation B. Boser 4 Substrate • Injection mechanisms • Epitaxial vs high resistivity substrate • Substrate contact – Minority carrier – Majority carrier – Backside contact • Guard ring –Iso la
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EECS 240 Lecture 15: Coupling and Isolation B. Boser 5 Common Substrate Types
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Coupling and Isolation B. Boser 6 Epitaxial Substrate D. K. Su, M. J. Loinaz, S. Masui, and B. A. Wooley, "Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits," IEEE Journal of Solid-State Circuits, vol. 28, pp. 420 - 430, April 1993. Note:
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This note was uploaded on 08/01/2008 for the course EECS 240 taught by Professor Boser during the Spring '04 term at University of California, Berkeley.

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L15 lecture full - Coupling Mechanisms Interconnects Mostly...

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