EET250_Unit2_Assignment_ChapterReview_(1) (1)

EET250_Unit2_Assignment_ChapterReview_(1) (1) - Unit 2...

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Unit 2 Assignment: Chapter Review This assignment covers the information provided in this unit’s Reading Assignment. However, there may be a need to search outside of the textbook. Remember that this is an assignment, not a quiz. So, please do not guess – find the answers. 1. The most popular form factor in use today for standard-sized desktop/tower computers is the ___D__. a. AT b. Proprietary c. ITX d. ATX e. BTX 2. Every motherboard has one or two VLSI circuits referred to as the “chipset.” Match the proper term to its description. Used in systems with newer CPUs that incorporate RAM and video interfacing on the CPU itself On computer made a few years back, when there were two chips in the chipsset, this component provided the interface with RAM and video On computers made a few years back, when there were two chips in the chipset, this component provided the interface with expansion devices such as IDE hard drives Barebones, generic level drivers, primarily used prior to the OS being loaded, which interfaced with basic system components. 3. From the following statements, select the one that is not true. a. Expansion cards should be inserted as straight as possible into their expansion slot. b. All devices, whether built into the motherboard or installed in an expansion slot, require some form of device driver. c. The contacts on expansion cards should be cleaned periodically with a pencil eraser. d. Modern systems have some voltage on the motherboard even if the system has been shut down, as long as it is plugged in. 4. Some stability problems can be resolved with improved implementation by which of the following? 5. CPUs made today are mostly __64___ bit processors. Answer consists of a number with no other information. 64 6. If a CPU is said to have a core speed of 3.4 GHz, this means _ 7. All Intel Core i7 processors use the same socket (they are all interchangeable). _False_ True False
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8. 9. Thermal compound, also known as thermal paste, is used to __D___
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