lecture20 - Lecture 20 Interconnect Parasitics EECS 312...

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EECS 312 1 Lecture 20: Interconnect Parasitics EECS 312 Reading: 4.3.1, 4.3.2
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Last Time EECS 312 2 Packaging provides an interface from the chip to the external world To send signals off-chip, we need to drive large capacitances – This is best done by creating a buffer chain where each inverter is ~3-4X larger than its driver – Often called cascaded or tapered buffer – Even on-chip wires can have large capacitances (pF) that require this technique
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