PARALLEL COOLING OF HIGH POWER DEVICES IN A SERIALLY COOLED ENVIROMENT.pdf - USOO6198628B1(12 United States Patent(10 Patent No Smith US 6 198,628 B1(45

PARALLEL COOLING OF HIGH POWER DEVICES IN A SERIALLY COOLED ENVIROMENT.pdf

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USOO6198628B1 (12) United States Patent (10) Patent No.: US 6, 198,628 B1 Smith (45) Date of Patent: *Mar. 6, 2001 (54) PARALLEL COOLING OF HIGH POWER 5,063,477 11/1991 Paggen et al. ....................... 361/384 DEVICES IN A SERIALLY COOLED 5,218,514 6/1993 Huynh et al. ........................ 361/384 EVIRONMENT 5,297.004 3/1994 Mazura ....... ... 361/690 5,297,005 3/1994 Gourdine .... ... 361/697 5,361,188 11/1994 Kondou et al. ...................... 361/695 (75) Inventor: Grant M. Smith, Bryn Athyn, PA (US) 5,398,159 3/1995 Andersson et al. .................. 361/695 5,456,632 10/1995 Ohtsu et al. ......................... 454/184 (73) Assignee: Unisys Corporation, Blue Bell, PA 5,559,673 9/1996 Gagnon et al. ...................... 361/695 (US) 5,680,295. 10/1997 Le et al. ............................... 361/695 5,751,549 * 5/1998 Eberhart et al. ..................... 361/695 (*) Notice: This patent issued on a continued pros- 5,793,608 * 11/1998 WNE - - - - - - - - - - - - - - - - - - - - - - - 361/695 ecution application filed under 37 CFR 1.53(d), and is subject to the twenty year FOREIGN PATENT DOCUMENTS patent term provisions of 35 U.S.C. O 272 961 6/1988 (EP). 154(a)(2). * cited by examiner Subject to any disclaimer, the term of this patent is extended or adjusted under 35 Primary Examiner—Gregory Thompson U.S.C. 154(b) by 0 days. (74) Attorney, Agent, or Firm-Rocco L. Adornato; Mark T. Starr; Ratner & Prestia (21) Appl. No.: 09/198,719 (57) ABSTRACT (22) Filed: Nov. 24, 1998 A System is provided for cooling electronic components and (51) Int. CI.7 H05H 7/20 for localized cooling of Selected electronic components. An air mover is mounted adjacent to an exhaust opening in order to generate a low pressure Zone within the cabinet's interior. An inlet opening is defined in a cabinet So that the air mover can generate a Serial air flow path extending from the inlet opening to the exhaust opening for cooling of electronic (56) References Cited SiN within the E. At least Secondary U.S. PATENT DOCUMENTS opening is defined in the cabinet so that the air mover can generate a parallel air flow path, for cooling of Selected (52) U.S. Cl. ............................................. 361/695; 454/184 (58) Field of Search ..................................... 361/688-690, 361/694-697, 724, 752; 454/184; 62/259.2 4,126.269 11/1978 Bruges - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 236/49 electronic components, that extends from the Secondary 4,158,875 6/1979 Tajima et al. . ... 361/384 opening and then ioins the Serial air flow path 4,528,614 7/1985 Shariff, et al. ... ... 361/379 pening pain. 4,774,631 9/1988 Okuyama et al. ... ... 361/384 4,985,804 1/1991 Campbell et al. ................... 361/384 20 Claims, 3 Drawing Sheets
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U.S. Patent Mar. 6, 2001 Sheet 1 of 3 US 6,198,628 B1 se se s se
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U.S. Patent Mar. 6, 2001 Sheet 2 of 3 US 6,198,628 B1 essa III earner re OOOH E OOI es OOOOOH OOOOOOOOOOO Hors OOOOOOOH s
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U.S. Patent Mar. 6, 2001 Sheet 3 of 3 US 6,198,628 B1 i fly F pp. a. s. A P a 137-ol : : : : AVVVAWAV A V V Hittitt A V 1 NNN v W M V S 11 v 4 VVVS a A C Y O st 11 R 136-o- | y A A
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US 6,198,628 B1 1 PARALLEL COOLING OF HIGH POWER DEVICES IN A SERIALLY COOLED EVIRONMENT FIELD OF THE INVENTION This invention relates to a System for cooling electronic equipment. In particular, it relates to the parallel cooling of high power devices in a Serially cooled environment. BACKGROUND OF THE INVENTION There is an ever-increasing need for electronic devices and Systems having improved reliability. One potential Source of failure for an electronic System is its cooling System. The electronic components of Such Systems typi cally generate a considerable amount of heat in an enclosed or Semi-enclosed space. It is often necessary to provide a cooling System in order to prevent temperature gradients that could compromise the function of Such electronic compo nentS.
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