Lab session 13. Sputtering.pdf - 11 Lab Session Metal Sputtering This class will be in room ET 105 You do not need to wear clean room attire Objectives

Lab session 13. Sputtering.pdf - 11 Lab Session Metal...

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1 11. Lab Session: Metal Sputtering This class will be in room ET 105. You do not need to wear clean room attire. Objectives : Following the successful completion of this lab, the student will be able to: 1. Use the sputtering system in the Idaho Microfabrication Laboratory to deposit metal films on silicon wafers. 2. Be able to determine the thickness of sputtered metal films. 3. Understand the principles of PVD (physical vapor deposition) - sputtering. Background : Sputtering is used in microfabrication processes to deposit a variety of films, mostly metals or metal alloys that serve as the interconnecting layers (wires) on an integrated circuit. Sputtering machines consist of a high vacuum chamber, a vacuum system, a source of AC or DC power, and a source of an inert sputtering gas such as Argon. The machine in the lab is a tabletop unit that processes only one wafer at a time. In high volume manufacturing, sputtering tools are much larger and are designed to process multiple wafers at a much faster rate.
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