1-16-07 competitive semiconductor manufacturing

1-16-07 competitive semiconductor manufacturing -...

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Jan. 16, 2007 RCL - CSM Findings 1 Competitive Semiconductor Competitive Semiconductor Manufacturing Manufacturing Prof. Robert C. Leachman Director, Competitive Semiconductor Manufacturing Program Engineering Systems Research Center University of California at Berkeley Revised Jan 16, 2007
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Jan. 16, 2007 RCL - CSM Findings 2 Agenda Agenda a Introduction to CSM Program a Technical metrics of fab performance a Economic interpretation a Key practices underlying leading performance
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Jan. 16, 2007 RCL - CSM Findings 3 CSM Program CSM Program a During 1991-2003, one of the largest interdisciplinary research programs at Berkeley (8 faculty, 15 students from Business, Economics and Engineering) a Fab performance benchmarking a Focus studies (MS and PhD projects) a 53 CSM reports may be ordered on the Web at http://euler.berkeley.edu/esrc/csm
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Jan. 16, 2007 RCL - CSM Findings 4 Benchmarking Benchmarking fab fab performance performance a 1991: Pilot phase with Intel, NEC and HP a 1992-96: Studied 29 fabs in USA, Japan, Korea, Taiwan and Europe under sponsorship of Alfred P. Sloan Foundation ` Mostly 6-inch wafer fabs (six 5-inch, two 4-inch fabs) operating process technologies ranging from 10 micron down to 0.4 micron line widths
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Jan. 16, 2007 RCL - CSM Findings 5 Benchmarking Benchmarking fab fab performance (cont.) performance (cont.) a 1997- 2001: Studied 10 fab lines running 8- inch wafers in 350nm and below CMOS technologies ` Sponsored by Sematech, SIRIJ/EAIJ, TSMC, UMC, Winbond, Samsung, Micrus, Cypress, ST Microelectronics ` Final report on this phase issued Mar., 2002 a 2002 - 2003: Study “systematic mechanisms” yield loss at 5 Sematech member-companies
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Jan. 16, 2007 RCL - CSM Findings 6 Factory data collection Factory data collection a Mail-Out Questionnaire (MOQ) a 2-3 years of fab history (plus updates) ` process technologies, production volumes, yields, cycle times ` equipment and facilities ` headcount and HR data a We compute technical metrics from these data. Identities of fabs are kept confidential.
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Jan. 16, 2007 RCL - CSM Findings 7 Studying practices: the site visit Studying practices: the site visit a Team of 8 faculty and graduate students for a 2 or 3 day visit a Tour fab (focus on evidence of self- measurement, communication, problem- solving activity a Interview cross-section of organization (managers, engineers, technicians, operators)
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Jan. 16, 2007 RCL - CSM Findings 8 Site visit (cont.) Site visit (cont.) a Sessions to review approaches to problem areas (yield improvement, equipment efficiency improvement, cycle time reduction, on-time delivery improvement, new process introductions) a Sessions to review problem-solving resources (CIM and information systems, process control, work teams, human resource development)
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Jan. 16, 2007 RCL - CSM Findings 9 Technical metrics Technical metrics
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Jan. 16, 2007 RCL - CSM Findings 10 Yield metrics Yield metrics a Line yield of a fabrication process accounts for all wafer losses occurring up through “E-Test” (wafer acceptance
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1-16-07 competitive semiconductor manufacturing -...

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