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Unformatted text preview: amount of very interesting information. 3. [D, None, 1.2] By scanning the literature, find the leading-edge devices at this point in time in the following domains: microprocessor, signal processor, SRAM, and DRAM. Determine for each of those, the number of integrated devices, the overall area and the maximum clock speed. Evaluate the match with the trends predicted in section 1.2. 4. [D, None, 1.2] Find in the library the latest November issue of the Journal of Solid State Cir-cuits. For each of the papers, determine its application class (such as microprocessor, signal processor, DRAM, SRAM), the type of manufacturing technology used (MOS, bipolar, etc.), the minimum feature size, the number of devices on a single die, and the maximum clock speed. Tabulate the results along the various application classes. 5. [E, None, 1.2] Provide at least three examples for each of the abstraction levels described in Figure 1.6. More to come in the very near future!...
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This note was uploaded on 07/09/2009 for the course ECE 4740 taught by Professor Bhave during the Spring '08 term at Cornell University (Engineering School).
- Spring '08