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IC Assembly-Ch9 - Today's Lecture Course Evaluations(first...

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Course Evaluations (first ~15 minutes) IC Assembly Lecture (Ch 9) Final Exam Info Today’s Lecture
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Level 0 – Wafer connections (Si Run Video) Level 1 – IC pads to package leads (today) Level 2 – Package leads to circuit board (week 5) Level 3 – Circuit board to motherboard (157 Lab) Level 4 – Motherboard to Case components (Lab) Interconnection Levels
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Process of electrically connecting IC I/O bond pads to package bond pads. Occurs after wafer fab & singulation. Purpose : Electrically connect IC to package, so that IC can be handled & tested. Interfaces: Metallurgical bond pad on IC (primarily Aluminum) Metallurgical bond pad on package (varies with package type) Electrical connection between bond pads (varies with assembly technologies) IC Assembly (Ch 9)
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Metallurgical : Bond pads often consist of layers of various metals. These layers are used to assist in preventing diffusion & providing adhesion and wetting . Without these layers, bond pads would more likely corrode, become mechanically unstable, crack and have poor bonding.
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