IC Assembly-Ch9

IC Assembly-Ch9 - Today's Lecture Course Evaluations (first...

Info iconThis preview shows pages 1–5. Sign up to view the full content.

View Full Document Right Arrow Icon
± Course Evaluations (first ~15 minutes) ± IC Assembly Lecture (Ch 9) ± Final Exam Info Today’s Lecture
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
± Level 0 – Wafer connections (Si Run Video) ± Level 1 – IC pads to package leads (today) ± Level 2 – Package leads to circuit board (week 5) ± Level 3 – Circuit board to motherboard (157 Lab) ± Level 4 – Motherboard to Case components (Lab) Interconnection Levels
Background image of page 2
Process of electrically connecting IC I/O bond pads to Purpose : Electrically connect IC to package, so that IC can be Interfaces: ± Metallurgical bond pad on IC (primarily Aluminum) ± Metallurgical bond pad on package (varies with package type) ± Electrical connection between bond pads (varies with assembly technologies) IC Assembly (Ch 9)
Background image of page 3

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
: ± Bond pads often consist of layers of various metals. ± These layers are used to assist in preventing diffusion & providing adhesion and wetting . ± Without these layers, bond pads would more likely
Background image of page 4
Image of page 5
This is the end of the preview. Sign up to access the rest of the document.

Page1 / 12

IC Assembly-Ch9 - Today's Lecture Course Evaluations (first...

This preview shows document pages 1 - 5. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online