PWB Assembly-Ch17

PWB Assembly-Ch17 - PWB Assembly (Ch 17) Process of...

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PWB Assembly (Ch 17) Process of mounting & soldering components onto PWB.
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Component Types ± Surface Mount: smaller, lighter, low cost use less “real estate” (board space) fewer holes to be drilled simpler automated assembly ± Through-Hole: large and heavy components large currents
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Dual In Line Through-Hole
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± Lead Styles ± Size ± Lead shape (Gull wing, J lead, butt or I lead) ± Leads allow components on both sides of board ± Common Package Shape ± SOIC, Small Outline IC ± PLCC, Plastic Leaded Chip Carrier ± QFP, Quad Flat Pack ± BGA, Ball Grid Array ± Cost Savings - More capability in less space Surface Mount ICs
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Gull Wing Lead
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J lead & I lead or Butt lead
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Gull Wing
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BGA & PGA (Pin Grid Array)
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Surface Mount Discrete Components ± ± Common Package Sizes: ± 0402 ± 0603 ± 0805 ± 1206 ± 0805 = 80mils X 50mils, L X W (mil = thousandths of an inch)
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PWB Assembly (Ch 17) ± Soldering ± Purpose : Create a reliable electrical, mechanical & thermal connection. ± Solder
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PWB Assembly-Ch17 - PWB Assembly (Ch 17) Process of...

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