Intro - Microsystems Packaging-Ch1

Intro - Microsystems Packaging-Ch1 - IME 156 Electronics...

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Gary Perks Office # 756-1463 (E-Mail: gperks@calpoly.edu) 20-208 (2 Story EE Faculty Office Bldg) E-Permits: All lab sections are now closed, not accepting adds. Roll at end of Class. Lectures: Friday 11:10 - 12pm Friday 12:10 – 1pm 33-287 Lab Sections: 192-105 -02 T 8-11am (Rinzel) -07 W 3-6pm (Perks) -03 T 12-3pm (Rinzel) -08 R 3-6pm (Perks) -04 R 8-11am (Rinzel) -05 R 12-3pm (Perks) IME 156 Electronics Manufacturing
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Lecture Topics z z Wk 2: PWB Fabrication (Ch16) z Wk 3: PWB Assembly (Ch 17) z Wk 4: Midterm I (Ch 1 & 16 AND Lecture) z z Wk 6: Troubleshooting Basics (cont.) z Wk 7: Making a Si Wafer IC “Silicon Run” Video (Ch 2) z Wk 8: Midterm II (Ch 2 (&video), 17, 19 AND Lecture) z Wk 9: IC Assembly (9) z Wk 10: Thanksgiving Holiday (No Class) z Wk 11: Cumulative Final Exam (last class) Covered
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Wk 1: Ch 1 (1.1 -> 1.4) Wk 2: Ch 16 (16.1 -> 16.8)
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Intro - Microsystems Packaging-Ch1 - IME 156 Electronics...

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