ME530241_2009_Lab_08

ME530241_2009_Lab_08 - ME 530.241: Electronics and...

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Unformatted text preview: ME 530.241: Electronics and Instrumentation Lab 8: Soldering Lab Louis L. Whitcomb and Kyle B. Reed * Department of Mechanical Engineering The Johns Hopkins University Spring 2009 Apparatus: Multimeter, DC Power Supply, oscilloscope, soldering iron, and solder. Components: Circuit board, LF411 op-amp, resistors, capacitors, and diodes. Pre-Lab: Read all the steps in this lab. Read http://en.wikipedia.org/w/index.php?title=Soldering&oldid=281620934 The purpose of this lab is give you some experience in circuit assembly, specifically: 1. Component identification 2. Circuit board component insertion finding the proper component orientation and the proper side of the circuit board for populating with electronic components. 3. Soldering: (a) Setup of soldering irons. (b) Tip cleaning and tinning the clean tip with solder. (c) Temperature control. (d) Soldering techniques to obtain good electrical connection and minimize thermal stress to components....
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ME530241_2009_Lab_08 - ME 530.241: Electronics and...

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