ME530241_2009_Lab_08 - ME 530.241 Electronics and...

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Unformatted text preview: ME 530.241: Electronics and Instrumentation Lab 8: Soldering Lab Louis L. Whitcomb and Kyle B. Reed * Department of Mechanical Engineering The Johns Hopkins University Spring 2009 Apparatus: Multimeter, DC Power Supply, oscilloscope, soldering iron, and solder. Components: Circuit board, LF411 op-amp, resistors, capacitors, and diodes. Pre-Lab: • Read all the steps in this lab. • Read • The purpose of this lab is give you some experience in circuit assembly, specifically: 1. Component identification 2. Circuit board component insertion – finding the proper component orientation and the proper side of the circuit board for populating with electronic components. 3. Soldering: (a) Setup of soldering irons. (b) Tip cleaning and tinning the clean tip with solder. (c) Temperature control. (d) Soldering techniques to obtain good electrical connection and minimize thermal stress to components....
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This note was uploaded on 09/22/2009 for the course MECH EN.530.101 taught by Professor Okamura during the Spring '09 term at Johns Hopkins.

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ME530241_2009_Lab_08 - ME 530.241 Electronics and...

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