mc14007ubrev3

5 nspf cl 35 ns tplh 02 nspf cl 20 ns tplh 015

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Unformatted text preview: Output Source Characteristics Figure 3. Typical Output Sink Characteristics These typical curves are not guarantees, but are design aids. Caution: The maximum current rating is 10 mA per pin. MOTOROLA CMOS LOGIC DATA MC14007UB 33 VDD 500 F Vin 7 0.01 F CERAMIC 14 Vout VSS CL Vout 20 ns Vin 90% 50% 10% tPHL 90% 50% 10% tTHL tTLH tPLH 20 ns VDD VSS VOH VOL ID PULSE GENERATOR Figure 4. Switching Time and Power Dissipation Test Circuit and Waveforms APPLICATIONS The MC14007UB dual pair plus inverter, which has access to all its elements offers a number of unique circuit applications. Figures 1, 5, and 6 are a few examples of the device flexibility. + VDD 2 DISABLE 3 10 1 11 9 INPUT 10 12 OUTPUT 3 C 9 8 6 DISABLE 6 7 Substrates of Pchannel devices internally connected to VDD; Substrates of Nchannel devices internally connected to VSS. A 4 5 7 B 12 8 1 OUTPUT VDD 14 OUT = A+BC 13 11 2 INPUT 1 0 X DISABLE 0 0 1 OUTPUT 0 1 OPEN Figure 6. AOI Functions Using Tree Logic X = Don't Care Figure 5. 3State Buffer MC14007UB 34 MOTOROLA CMOS LOGIC DATA OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 63208 ISSUE Y NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15_ 0.51 1.01 A 14 9 B 1 7 C L T SEATING PLANE K F D 14 PL G 0.25 (0.010) M N J T A S 14 PL M 0.25 (0.010) M T B S DIM A B C D F G J K L M N P SUFFIX PLASTIC DIP PACKAGE CASE 64606 ISSUE L 14 8 B 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015...
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This note was uploaded on 10/13/2009 for the course ECE 4902 taught by Professor Mcneill during the Spring '01 term at WPI.

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