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Presentation 7 thin film

Presentation 7 thin film - Historical Development and Basic...

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Historical Development and Basic Concepts Two main deposition methods are used today: 1. Chemical Vapor Deposition (CVD) 2. Physical Vapor Deposition (PVD) - APCVD, LPCVD, PECVD, HDPCVD - evaporation, sputter deposition Chemical Vapor Deposition (CVD) Quartz reaction chamber RF induction (heating) coils Exhaust scrubber Trap Furnace - with resistance heaters Standup wafers SiCl Silicon wafers Graphite susceptor vent VaccumPump SiH 4 + O 2 SiO 2 + 2H 2 H 2 Ar H 2 +PH 3 H 2 +B2H 6 HCl 4 H 2 SiCl 4 + 2H 2 Si + 4HCl Gas control and sequencer SiH 4 O 2 Source Gases APCVD - Atmospheric Pressure CVD LPCVD - Low Pressure CVD
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Chemical Vapor Deposition 1 2 6 7 Gas stream Susceptor Wafer 3 4 5 1. Transport of reactants to the deposition region. *2. Transport of reactants from the main gas stream through the boundary layer to the wafer surface layer to the wafer surface. *3. Adsorption of reactants on the wafer surface. *4. Surface reactions, including: chemical decomposition or reaction, surface migration to attachment sites (kinks and ledges); site incorporation; and other surface reactions (emission and redeposition for example). *5. Desorption of byproducts. 6 Transport of byproducts through boundary layer 6. Transport of byproducts through boundary layer. 7. Transport of byproducts away from the deposition region.
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