HW8Sol - (20 points) Process flow continued on next page....

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EECE 321: Electronics-I (Spring 2006, University of New Mexico) Homework-VII (Due Date: Thursday April 27 th , In class) In the class, we learnt about the fabrication process for a CMOS inverter. In the following process, draw the masks used for various steps and identify the various processes ( e.g, diffusion, polysilicon deposition, metal deposition, etc. ..). Use a clear field mask and identify whether you are using a positive or negative photoresist. How many masks are used in this process.
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Unformatted text preview: (20 points) Process flow continued on next page. MASK TOP VIEW N-Well Formation (Diffusion) Negative photo resist Oxide and Nitride Deposition Negative Photo resist P-channel stop same mask used with positive photo resist Gate Metal Deposition Negative Photo resist Diffusion Negative photo resist MASK TOP VIEW PHYSICAL STRUCTURE P + Diffusion Negative Photo resist Oxidation Positive photo resist Metal Deposition Negative Photo resist...
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HW8Sol - (20 points) Process flow continued on next page....

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