35 THERMAL_STRESS[1]

35 THERMAL_STRESS[1] - THERMAL STRESS Overview Thermally...

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Thermally Induced Stress When a structure is heated or cooled, it deforms by expanding or contracting. If the deformation is somehow restricted — by displacement constraints or an opposing pressure, for example — thermal stresses are induced in the structure. Another cause of thermal stresses is non- uniform deformation, due to different materials (i.e, different coefficients of thermal expansion). Thermal stresses due to constraints Thermal stresses due to different materials THERMAL STRESS …Overview There are two methods of solving thermal-stress problems using ANSYS. Both methods have their advantages. Sequential coupled field - Older method, uses two element types mapping thermal results as structural temperature loads + Efficient when running many thermal transient time points but few structural time points + Can easily be automated with input files Direct coupled field + Newer method uses one element type to solve both physics problems + Allows true coupling between thermal and structural phenomena - May carry unnecessary overhead for some analyses THERMAL STRESS …Overview
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The Sequential method involves two analyses: 1. First do a steady-state (or transient) thermal analysis. Model with thermal elements. Apply thermal loading. Solve and review results. 2. Then do a static structural analysis. Switch element types to structural.
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This note was uploaded on 01/20/2010 for the course ME master taught by Professor Mon during the Spring '09 term at Hanyang University.

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35 THERMAL_STRESS[1] - THERMAL STRESS Overview Thermally...

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