lec2 - Lecture 2 VLSI Test Process and Equipment Motivation...

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Copyright 2001, Agrawa VLSI Test: Lecture 2 1 Lecture 2 VLSI Test Process and Equipment Motivation Types of Testing Test Specifications and Plan Test Programming Test Data Analysis Automatic Test Equipment Parametric Testing Summary
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Copyright 2001, Agrawa VLSI Test: Lecture 2 2 Motivation Need to understand Automatic Test Equipment (ATE) technology Influences what tests are possible Serious analog measurement limitations at high digital frequency or in the analog domain Understand capabilities for digital logic, memory, and analog test for testing System-on-a-Chip (SOC) Need to understand parametric testing For setup and hold time measurements For determination of V IL , V IH , V OL , V OH , t r , t f , t d , I OL , I OH , I IL , I IH
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Copyright 2001, Agrawa VLSI Test: Lecture 2 3 Types of Testing Verification testing , characterization testing , or design debug Verifies correctness of design and correctness of test procedure – may require correction of either or both Manufacturing testing Factory testing of all manufactured chips for parametric and logic faults, and analog specifications Burn-in or stress testing Acceptance testing ( incoming inspection ) User (customer) tests purchased parts to ensure quality
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Copyright 2001, Agrawa VLSI Test: Lecture 2 4 Testing Principle
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Copyright 2001, Agrawa VLSI Test: Lecture 2 5 Automatic Test Equipment (ATE) Consists of: Powerful computer Powerful 32-bit Digital Signal Processor (DSP) for analog testing Test Program (written in high-level language) running on the computer Probe Head (actually touches the bare or packaged chip to perform fault detection experiments) Probe Card or Membrane Probe (contains electronics to measure signals on chip pin or pad)
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Copyright 2001, Agrawa VLSI Test: Lecture 2 6 Characterization or Verification Test Ferociously expensive Applied to selected (not all) parts Used prior to production or manufacturing test May comprise: Scanning Electron Microscope tests Bright-Lite detection of defects Electron beam testing Artificial intelligence (expert system) methods Repeated functional tests
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Copyright 2001, Agrawa VLSI Test: Lecture 2 7 Characterization (Cont.) Worst-case test Choose test that passes/fails chips Select statistically significant sample of chips Repeat test for every combination of environmental variables Plot results in Shmoo plot Diagnose and correct design errors Continue throughout production life of chips to improve design and process to increase yield
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Copyright 2001, Agrawa VLSI Test: Lecture 2 8 Shmoo Plot t OTD CS DATA SRAM read operation: t OTD  = time to  DATA tristated after chip deselect
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Copyright 2001, Agrawa VLSI Test: Lecture 2 9 Manufacturing Test Determines whether manufactured chip meets specification Must cover high % of modeled faults Must minimize test time (to control cost)
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This note was uploaded on 01/26/2010 for the course ECE 682 taught by Professor Tom during the Spring '10 term at University of South Dakota.

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lec2 - Lecture 2 VLSI Test Process and Equipment Motivation...

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