MEMSdesign4 - Reprint from proceedings MEMS2000 Miyazaki...

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Reprint from proceedings MEMS2000, Miyazaki, Japan ADVANCED HYBRID INTEGRATED LOW-POWER TELEMETRIC PRESSURE MONITORING SYSTEM FOR BIOMEDICAL APPLICATIONS T. Eggers 1 , C. Marschner 2 , U. Marschner 3 , B. Clasbrummel 4 , R. Laur 2 , J. Binder 1 1 Institute for Microsensors, -actuators and -systems (IMSAS), University of Bremen, P.O. Box 330440, 28334 Bremen, Germany, Tel.: +49 (0) 421 218 4848, Fax: +49 (0) 421 218 4774, e-mail: [email protected], 2 Institute for Electromagnetic Theory and Microelectronics (ITEM), University of Bremen, 3 ETD Elektronik Technologie Dresden GmbH, 4 Berufsgenossenschaftliche Kliniken Bergmannsheil, University of Bochum, Germany ABSTRACT A new, highly miniaturized hybrid integrated solution for telemetric pressure measurement in biomedical applications is presented. The telemetrically powered ITES (Implantable telemetric endo-system) consists of a surface micro-machined capacitive type absolute pressure sensor fabricated in an eight-mask MOS-like process and two low-power ASIC for capacitance change read-out and telemetric data and energy transmission. An advanced flip-chip mounting and assembly technology is applied to overcome most of the drawbacks of hybrid integration and to fulfill space requirements of biomedical implants without monolithic sensor integration. This paper emphasizes system design considerations of the hybrid system like its partitioning and the mounting and assembly technology. The pressure sensor design and its associated read-out is discussed in detail. INTRODUCTION In the last years there have been a lot of high invest investigations in monolithically integrated smart sensor systems [1-5], but only few devices have been a commercial success until now. Reasons for this may be: If the sensor is fully integrated into the IC process flow, the sensor performance is limited by the physical properties respectively by the order of the used layers. If the sensor is completely processed after the electronics finished, the costs increase because of additional masks and thereby reduced yield. This holds also for additive technologies like on-chip electroplating. The high invest for complete monolithical integration in the electronics process is only justifiable in high volume markets. The highest invests are focused in the automotive area at the moment (pressure, acceleration and yaw-rate sensors). Another solution is the use of separate sensor chips packaged together in specific housings with an ASIC using standard processes available through manufacturers worldwide. Advantages for this are: The two processes can be optimized separately, respectively remain unchanged for the electronics part. The sensor can be fabricated on older and much more simple fabrication lines because there is no need for very low dimensions in the sub-μm range for most physical sensor principles. A modern low-power low-voltage CMOS/ BiCMOS process with mixed-signal libraries for cell based, highly automated design can be used for the electronics part. The drawbacks are the higher costs
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This note was uploaded on 02/08/2010 for the course MECHANICAL 6537 taught by Professor Stiharu during the Winter '10 term at Concordia Canada.

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MEMSdesign4 - Reprint from proceedings MEMS2000 Miyazaki...

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