BioE121-Spring03-mt1-Lee-solns

BioE121-Spring03-mt1-Lee-solns - UNIVERSITY OF CALIFORNIA,...

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Created by Poorya Sabounchi on 3/27/03 poorya@me.berkeley.edu UNIVERSITY OF CALIFORNIA, BERKELEY BERKELEY DAVIS IRVINE LOS ANGELES RIVERSIDE SAN DIEGO SAN FRANCISCO SANTA BARBARA SANTA CRUZ DEPARTMENT OF BIOENGINEERING BERKELEY, CALIFORNIA 94720-1762 BioE 121 Midterm #1 Solutions Problem #1. (20 points) Photolithography a. (5 points) Describe basic photochemical mechanism of a positive resist (DQN) b. (10 points) Describe the photochemical mechanism of reverse image process of a positive resist. c. (5 points) Compare optical and e-beam lithography methods (resolutions limit, process time, cost, etc) a) BioMEMS DQN Positive Photoresist • DQN: – Photoactive compound Diazoquinone (DQ) – Matrix material (N): Novolac AAAA Novolac resin: matrix I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I hv I Inhibitor A Acid b) Compression by CVISION Technologies’ PdfCompressor. For Evaluation Purposes Only
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Created by Poorya Sabounchi on 3/27/03 poorya@me.berkeley.edu BioMEMS Image Reverse Resist N 2 O R COOH R COOH R R COOH R R +CO 2 hv H 2 O U hv H 2 O CO 2 CO 2 O N 2 flood exposure develop bake e-beam Lithography: Advantage : Very small beam spot ( < 1nm), can define very small features Disadvantages: Low throughput – a serial writing process versusthe parrallel writing process of optical lithography. Proximity effect- Backscattered electrons from substrate material may affect critical feature size. Compression by CVISION Technologies’ PdfCompressor. For Evaluation Purposes Only
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Created by Poorya Sabounchi on 3/27/03 poorya@me.berkeley.edu Problem #2. (20 points) Sacrificial Layer Process a. (10 points). Figure 1 show an encapsulated cantilever in the air. Show the process steps to accomplish this device by cross sectional fabrication steps b. (10 points). Describe deposition and etching methods for each step
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BioE121-Spring03-mt1-Lee-solns - UNIVERSITY OF CALIFORNIA,...

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