ch02 - 21IntegratedCircuits s 21 Integrated Circuits(IC)...

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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2 Digital Components 2-1 2-1  Integrated Circuits Integrated Circuits(IC) Digital circuits are constructed with Integrated Circuits An Integrated Circuits is a small silicon semiconductor crystal, called chip The various gates are interconnected inside the chip to form the required circuit The chip is mounted in a ceramic or plastic container, and connections are welded by thin gold wires to external pins to form the integrated circuits The number of pins may range from 14 in a small IC package to 100 or more in a larger package Each IC has a numeric designation printed on the surface of the package for identification http://www.fullman.com/semiconductors/index.html Logic Family ¤ M /& MOSFET BJT MOS Family(N or P Channel) : High Component Density CMOS Family(N or P Channel) : Low Power TTL Family : ECL Family : v O TTL O CMOS
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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2 Digital Components 2-2 TTL Family 54 Series : -55 ° C 125 °C, Military 74 Series : 0 ° C 70 ° C, Commercial » 54/74 : Standard » 54L/74L : Low-power » 54S/74S : Schottky » 54LS/74LS : Low-power, Schottky » 54H/74H : High-speed CMOS Family 4000 Series(RCA), MC14500(Motorola), 5000(Toshiba), 54C/74C Series, 54HC/74HC Series » rAM : -30 ° C 85 ° C , Fan-out o& , Noise Margin o& , Low-power * Schottky Diode v ECL O v ( 0.4 Volt O ) Pt Si 0.2 0.4 0.6 V i Schottky Diode Schottky Transistor Forward Bias
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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2 Digital Components 2-3 Package Types Small Outline Transistor (SOT) Small Outline Package (SOP) Dual-In-Line Package (DIP) Plastic/Ceramic Pin Grid Array (PPGA/CPGA) Plastic Leaded Chip Carrier (PLCC)
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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2 Digital Components 2-4 Plastic Quad Flat Package (PQFP) TO Packages (Transistor single Outline) Ceramic Leadless Chip Carrier (LCC)
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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2 Digital Components 2-5 2-2  Decoder/Encoder Decoder A combinational circuit that converts binary information from the n coded inputs to a maximum of 2 n unique outputs n -to- m line decoder = n x m decoder n inputs, m outputs If the n-bit coded information has unused bit combinations, the decoder may have less than 2 n outputs m 2 n 3-to-8 Decoder Logic Diagram : Fig. 2-1 Truth Table : Tab. 2-1 Commercial decoders include one or more Enable Input(E) Fig. 2-1 3-to-8 Decoder Tab. 2-1 Truth table for 3-to-8 Decoder A2 A1 A0 D0 D1 D2 D3 D4 D5 D6 D7 Enable(E) Enable E A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0 x x x 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 0 0 0 0 1 0 1 0 1 0 0 0 0 0 0 1 0 0 1 0 1 1 0 0 0 0 1 0 0 0 1 1 0 0 0 0 0 1 0 0 0 0 1 1 0 1 0 0 1 0 0 0 0 0 1 1 1 0 0 1 0 0 0 0 0 0 1 1 1 1 1 0 0 0 0 0 0 0 Inputs Outputs
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Computer System Architecture Dept. of Info. Of Computer Chap. 2 Digital Components Chap. 2
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ch02 - 21IntegratedCircuits s 21 Integrated Circuits(IC)...

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