HW1-solution - HOMEWORK #1 Solution ECE 4750 / CS 4420...

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HOMEWORK #1 Solution ECE 4750 / CS 4420 – Computer Architecture Due Thursday, October 8th at midnight (11:59pm) Problem 1.1 [20 points] (a) Dies/wafer = (pi * ((wafer radius)^2)/die area) - ( (pi * wafer diameter)/ ( (2*Die area)^.5))) Die Yield = Wafer yield * ( 1 + ((defects per unit area *Die area)/alpha))^(-alpha) good dies/wafer = dies per wafer * die yield Alpha 21264C Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 115 ) - ((3.14 * 200)/((2*115)^.5))) = 231.63 ~ 231 Die yield = (1 + ((1.15 * 0.5)/4))^(-4) * (0.95) = 0.55 good dies/wafer = (231 * 0.55) = 127.05 ~ 127 Power-3-II Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 163 ) - ((3.14 * 200)/((2*163)^.5))) = 157.85 ~ 157 Die yield = (1 + ((1.63 * 0.5)/4))^(-4) * (0.95) = 0.45 good dies/wafer = ( 157 * .45 ) = 70.65 ~ 70 Itanium Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 300 ) - ((3.14 * 200)/((2*300)^.5))) = 79.02 ~ 79 Die yield = (1 + ((3.00 * 0.5)/4))^(-4) * (0.95) = 0.26 good dies/wafer = ( 79 * .26 ) = 20.54 ~ 20 MIPS R14000 Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 204 ) - ((3.14 * 200)/((2*204)^.5))) = 122.83 ~ 122 Die yield = (1 + ((2.04 * 0.5)/4))^(-4) * (0.95) = 0.38 good dies/wafer = ( 122 * .38 ) = 46.36 ~ 46
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Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 210 ) - ((3.14 * 200)/((2*210)^.5))) = 118.88 ~ 118 Die yield = (1 + ((2.10 * 0.5)/4))^(-4) * (0.95) = 0.37 good dies/wafer = ( 118 *.37 ) = 43.66 ~ 43 (b) cost per projected good die before packaging and testing = estimated wafer cost/good dies per wafer Alpha 21264C cost per projected good die = 4700/127 = $37 Power-3-II cost per projected good die = 4000/70 = $57.14 Itanium cost per projected good die = 4900/20 = $245.00 MIPS R14000 cost per projected good die = 3700/46 = $80.43 Ultra Sparc III cost per projected good die = 5200/43 = $120.93 (c) Assuming Wafer yield is 95% cost of good,tested,packaged die = ( cost of die + cost of testing die + cost of packaging) cost of testing die = ( cost of testing per hour * average die test time ) / die yield Alpha 21264C cost of good,tested,packaged die = (37 + (((440/3600) * 25)/.55) + 25) = $67.55 Power-3-II cost of good,tested,packaged die = (57.14 + (((420/3600) * 20)/.45) + 20)
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This note was uploaded on 03/26/2010 for the course ECE 4750 taught by Professor Suh during the Spring '07 term at Cornell University (Engineering School).

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HW1-solution - HOMEWORK #1 Solution ECE 4750 / CS 4420...

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