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HW1-solution

# HW1-solution - HOMEWORK#1 Solution ECE 4750 CS 4420...

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HOMEWORK #1 Solution ECE 4750 / CS 4420 – Computer Architecture Due Thursday, October 8th at midnight (11:59pm) Problem 1.1 [20 points] (a) Dies/wafer = (pi * ((wafer radius)^2)/die area) - ( (pi * wafer diameter)/ ( (2*Die area)^.5))) Die Yield = Wafer yield * ( 1 + ((defects per unit area *Die area)/alpha))^(-alpha) good dies/wafer = dies per wafer * die yield Alpha 21264C Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 115 ) - ((3.14 * 200)/((2*115)^.5))) = 231.63 ~ 231 Die yield = (1 + ((1.15 * 0.5)/4))^(-4) * (0.95) = 0.55 good dies/wafer = (231 * 0.55) = 127.05 ~ 127 Power-3-II Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 163 ) - ((3.14 * 200)/((2*163)^.5))) = 157.85 ~ 157 Die yield = (1 + ((1.63 * 0.5)/4))^(-4) * (0.95) = 0.45 good dies/wafer = ( 157 * .45 ) = 70.65 ~ 70 Itanium Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 300 ) - ((3.14 * 200)/((2*300)^.5))) = 79.02 ~ 79 Die yield = (1 + ((3.00 * 0.5)/4))^(-4) * (0.95) = 0.26 good dies/wafer = ( 79 * .26 ) = 20.54 ~ 20 MIPS R14000 Dies/wafer = ((( 3.14 * ((200/2)^2) ) / 204 ) - ((3.14 * 200)/((2*204)^.5))) = 122.83 ~ 122 Die yield = (1 + ((2.04 * 0.5)/4))^(-4) * (0.95) = 0.38 good dies/wafer = ( 122 * .38 ) = 46.36 ~ 46

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