Thermoelectric Handbook

Thermoelectric Handbook - ISO 9001:2000 CERTIFIED...

Info iconThis preview shows pages 1–4. Sign up to view the full content.

View Full Document Right Arrow Icon
THERMOELECTRIC HANDBOOK Product Information Assembly Information Performance and Properties The Standard in Thermoelectrics ISO 9001:2000 CERTIFIED
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Table of Contents Product Information Thermoelectric History/General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Thermoelectric Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Structure and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Parameters Required for Device Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Design/Selection Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Thermoelectric Multistage (Cascade) Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Typical Device Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Assembly Information Assembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Procedure For Assembling Lapped Modules To Heat Exchangers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Procedure For Assembling Solderable Modules To Heat Exchangers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Performance and Properties Device Performance Formulae . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Heat Transfer Formulae . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Typical Properties of Materials (@ 21°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Reliability & Mean Time Between Failures (MTBF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 ® TEL: 609-393-4178 • FAX: 609-393-9461 • WEB: www.melcor.com • EMail: tecooler@melcor.com For a list of Global Sales Offices visit: www.melcor.com
Background image of page 2
Thermoelectric History/ General Information What are thermoelectric heat pumps? Thermoelectric heat pumps perform the same cooling function as freon-based vapor compression or absorption refrigerators. In all such units, thermal energy is extracted from a region, thereby reducing its temperature, then rejected to a "heat sink" region of higher temperature. Vapor-cycle devices have moving mechanical parts and require a working fluid, while thermoelectric elements are totally solid state. Melcor's solid state heat pumps use thermocouples made of high performance crystalline semiconductor material. Passing a current through the heat pump generates a temperature differential across the thermocouples, with maximum ratings of 70°C and higher. Solid state heat pumps have been known since the dis- covery of the Peltier effect in 1834. The devices became practical only recently, however, with the development of semiconductor thermocouple materials. Melcor utilizes bismuth telluride, a quaternary alloy of bismuth, tellurium, selenium and antimony - doped and processed to yield oriented polycrystalline semiconductors with anisotropic thermoelectric properties. The couple, connected in series electrically and in parallel thermally, are integrated into modules. The modules are packaged between metallized ceramic plates to afford optimum electrical insulation and thermal conduction with high mechanical strength in com- pression. Typical Melcor modules contain from 3 to 127 thermocouples; high technology applications for sophisti- cated instruments and communication systems require very small, low current modules, whereas low-cost, high capacity modules are in demand for a growing number of commercial applications. Modules can be mounted in par- allel to increase the heat transfer effect or can be stacked in multistage cascades to achieve high differential temper- atures.
Background image of page 3

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Image of page 4
This is the end of the preview. Sign up to access the rest of the document.

This note was uploaded on 05/21/2010 for the course MS Thermoelec taught by Professor Snyder during the Spring '10 term at Caltech.

Page1 / 16

Thermoelectric Handbook - ISO 9001:2000 CERTIFIED...

This preview shows document pages 1 - 4. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online