rn2 - c Pressure d Gas flow rate e Reactor materials f...

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Lecture 10 Dry Etching Review Notes 1. What is selectivity? 2. What is dry etching including advantages and limitations? 3. What are the main types of dry etching processes? a. Non-plasma-based b. Plasma-based i. Physical ii. Chemical iii. Reactive ion etching iv. Deep reactive ion etching 4. What is plasma and how is it formed in a dry etching chamber? 5. What are the main parameters that control plasma formation? a. Temperature b. Power
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Unformatted text preview: c. Pressure d. Gas flow rate e. Reactor materials f. Reactor cleanliness g. Loading (microloading) h. Mask materials 6. What are the main steps in dry etching? 7. What are the important parameters including limitations of processes listed in review point #3. 8. How does DRIE (Bosch process) work? a. Uses high density plasma to alternatively etch silicon and deposit a etch-resistant polymer on side walls...
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at Utah.

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