Unformatted text preview: c. Pressure d. Gas flow rate e. Reactor materials f. Reactor cleanliness g. Loading (microloading) h. Mask materials 6. What are the main steps in dry etching? 7. What are the important parameters including limitations of processes listed in review point #3. 8. How does DRIE (Bosch process) work? a. Uses high density plasma to alternatively etch silicon and deposit a etch-resistant polymer on side walls...
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at Utah.
- Spring '10