hw3 - Fundamentals of Microfabrication BIOEN 6421 EL EN...

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Fundamentals of Microfabrication Homework 3 BIOEN 6421, EL EN 5221 & 6221, ME EN 5050 & 6050 Homework #3 Due Monday, March 03, 2010 1. Compare the advantages and disadvantages of evaporation and sputtering for depositing thin films of metal. Text 2. List five advantages that dry etching has when compared to wet etching. Also, list three of the most important disadvantages. Dry etching advantages: 1. No stiction while etching thin free-standing structures 2. Both isotropic and anisotropic profiles possible without dependence on crystallographic planes 3. High aspect ratio structures with near-straight walls possible (e.g. deep reactive ion etching) 4. High throughput 5. Cleaner process Dry etching disadvantages: 1. Complex equipment and processes involved (and more expensive setup) 2. Lower etchmask selectivity 3. Process parameters need to be characterized more frequently 4. Contamination more likely 3. What is the difference between top dose, bottom dose, and critical dose in x-ray lithography?
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  • Spring '10
  • HimanshuJ.Sant
  • Semiconductor device fabrication, Etching, Microfabrication, Dry etching advantages, dry etching processes

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