hw3 - Fundamentals of Microfabrication BIOEN 6421 EL EN...

Info iconThis preview shows pages 1–2. Sign up to view the full content.

View Full Document Right Arrow Icon
Fundamentals of Microfabrication Homework 3 BIOEN 6421, EL EN 5221 & 6221, ME EN 5050 & 6050 Homework #3 Due Monday, March 03, 2010 1. Compare the advantages and disadvantages of evaporation and sputtering for depositing thin films of metal. Text 2. List five advantages that dry etching has when compared to wet etching. Also, list three of the most important disadvantages. Dry etching advantages: 1. No stiction while etching thin free-standing structures 2. Both isotropic and anisotropic profiles possible without dependence on crystallographic planes 3. High aspect ratio structures with near-straight walls possible (e.g. deep reactive ion etching) 4. High throughput 5. Cleaner process Dry etching disadvantages: 1. Complex equipment and processes involved (and more expensive setup) 2. Lower etchmask selectivity 3. Process parameters need to be characterized more frequently 4. Contamination more likely 3. What is the difference between top dose, bottom dose, and critical dose in x-ray lithography? See text but not required for this assignment.
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Image of page 2
This is the end of the preview. Sign up to access the rest of the document.

This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at Utah.

Page1 / 2

hw3 - Fundamentals of Microfabrication BIOEN 6421 EL EN...

This preview shows document pages 1 - 2. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online