hw2hint - Fundamentals of Micromachining BIOEN 6421, EL EN...

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Fundamentals of Micromachining Homework 2 BIOEN 6421, EL EN 5221 & 6221, ME EN 5050 & 6050 2/23/10 Homework #2 Due Monday, March 01, 2010 1. You are using KOH etching to define a 200 μ m thru-hole in a 100 wafer. What should the dimensions on your mask be if you are using a: a) 400 μ m thick wafer b) 600 μ m wafer. What would be the dimensions of the thru-hole be if you used the mask intended for the 400 μ m thick wafer on the 600 μ m thick wafer? Pg 188 text 2. You are using KOH to etch ports in a 400 μ m thick wafer. What minimum thickness of SiO 2 is needed to provide a mask for KOH etching? If Si 3 N 4 etches at 1.5 Å/min using the same conditions, how thick would it need to be to serve as a mask? Assume conditions of 20% KOH at 60 C Etchrate Si=26.7 um/hr Etchrate SiO2= 50 nm/hr 3. If the shape drawn below was used as a mask for KOH etching, draw a top and side view of what the hole would look like if allowed to go until only 111 planes are exposed. Refer Text pg 191 to 194 or Peterson’s paper (uploaded on webct under Additional Reading folder).
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at University of Utah.

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hw2hint - Fundamentals of Micromachining BIOEN 6421, EL EN...

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