11a - Midterm Review Himanshu J Sant Fundamentals of...

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Midterm Review March 08, 2010 Himanshu J. Sant Fundamentals of Micromachining Courtesy: Dr. Ian Papautsky, University of Cincinnati Micropipettes • Used to interface prepared samples and miniaturized analysis systems • Enabling technology that allows high density analysis systems to be interfaced in parallel • Picoliter to nanoliter volumes
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Schematic for Fabrication Step 1 Make Membrane Silicon Wafer Why? Does the wafer get thicker? A.Boron diffusion B.Mask deposition C.Photoresist patterning D.Mask patterning E. Photoresist removal F. KOH Etching
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Silicon Wafer What material? How do we deposit it? A.Boron diffusion B.Mask deposition C.Photoresist patterning D.Mask patterning E. Photoresist removal F. KOH Etching Step 1 Make Membrane Silicon Wafer A.Boron diffusion B.Mask deposition C.Photoresist patterning D.Mask patterning E. Photoresist removal F. KOH Etching What kind of photoresist? Mask alignment
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at Utah.

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11a - Midterm Review Himanshu J Sant Fundamentals of...

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