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Unformatted text preview: Microsystems Packaging Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000. Microsystems Packaging Lecture Outline
• • • • • • • What does packaging consist of? Who are we packaging for? Why worry about packaging? Goals of packaging Types of packages Packaging examples Packaging processes Microsystems Packaging: An Introduction Page 2 © 2003 Sandia National Laboratories Packaging Consists Of
• • • • Dicing/Singulating Mechanical Connection to Package/Circuit Board Electrical Connections/Interface Sensing Connections/Interface
– Fluid I/O – Light I/O – Environment I/O (Temperature, Pressure, Humidity, etc) • Environmental Protection
– – – – Scratches Dirt/Debris Humidity Temperature Microsystems Packaging: An Introduction Page 3 © 2003 Sandia National Laboratories Who are we packaging for?
• Package for testing – Most university research – Must be able to attach to test equipment – Must be able to interface with device to take needed measurements and data – Doesn’t matter how it looks • – Make it work at any cost Package for customer – Does the device work? – Does the package work? • • • Size Connections Environment Robustness – Temperature, humidity, dirt – Scratching, dropping – Does it look good?
Microsystems Packaging: An Introduction Page 4 © 2003 Sandia National Laboratories – Price is critical Why Worry About Packaging?
• The package is integral to the final product • You don’t have a product until it is in a package • What is a device without a package (a toy?) • Packaging is 40 to 80% of the cost • Custom packaging solutions have long lead times • Package design must be a part of product design, not an afterthought (throw it over the wall)
– Design for Manufacture & Concurrent Engineering • Consider product trade-offs up front as a team! • This is probably one of the most overlooked and understudied areas in MEMS
Microsystems Packaging: An Introduction Page 5 © 2003 Sandia National Laboratories GOALS OF PACKAGING
Protect From Mechanical Damage Optical Devices Need to Protect Chip From let Light in and Out Chemicals and Moisture Microfluidic devices have Fluids coming in and out Environmental Sensors need to let the Environment in (dust, dirt, pollution, …) Remove Heat Generated By The C...
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at University of Utah.
- Spring '10