An introduction page 6 2003 sandia national

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Unformatted text preview: hip Get Electrical Signals and Power to/from IC Provide Good Mechanical Attachment to PC Board Don’t Limit Performance Microsystems Packaging: An Introduction Page 6 © 2003 Sandia National Laboratories Low Cost Package Types • Huge variety of packages – for example, see http://www.amkor.com Plastic Leaded Chip Carrier Source: Amkor • PEMS: plastic encapsulated microelectronics – Not generally suited for MEMS Ceramic Package • Ceramic packages – Open cavity, can be hermetic • Metal packages – Open cavity, can be hermetic TO-8 Can Source: rfcafe.com • Considerations – # of Pins, I/O needs, additional chips, volume, sealing, cost, off-the-shelf vs. custom, ... Microsystems Packaging: An Introduction Page 7 © 2003 Sandia National Laboratories CERAMIC AND METAL PACKAGES Ceramic Metal Microsystems Packaging: An Introduction Page 8 © 2003 Sandia National Laboratories Thermopiles - Source: perkinelmer.com Amkor MEMS Packages Micro Lead Frame Ball Grid Array Small Outline IC Micro Lead Frame System in Package Microsystems Packaging: An Introduction Page 9 © 2003 Sandia National Laboratories Cross-Section Microsystems Packaging: An Introduction Page 10 © 2003 Sandia National Laboratories Packaging Examples • Packaging for testing – Iridium oxide biointerface test chip – Microfluidic test chip – Hydrogel pressure sensor • Packaging for customers – – – – – Microtweezers Micromirror Picoprojector Neural Array Cell phone camera packaging Pressure sensor glass cap Microsystems Packaging: An Introduction Page 11 © 2003 Sandia National Laboratories Packaging Example: Iridium Oxide Test Chip IrO Sensing Electrodes Cu Traces to Attach Edge Connector PC Board Wire Bonds Mounting Wax Silicone Over Wire Bonds Microsystems Packaging: An Introduction Page 12 © 2003 Sandia National Laboratories Packaging for Testing: Microfluidic Chip Microsystems Packaging: An Introduction Page 13 © 2003 Sandia National Laboratories Hydrogel Sensors Hydrogel Cavity Microsystems Packaging: An Introduction Page 14 © 2003 Sandia National Laboratories Backing Plate Hydrogel Sensor Packaging for Testing Microsystems Packaging: An Introduction Page 15 © 2003...
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