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Unformatted text preview: uring bonding can be very large. 7. The width of the SAC OX cuts in the bonding ring should be at least 6 µm and preferably 10 µm. 8. Both clear and translucent glass covers are available. 9. This is a full wafer process and does not work well on individual die. Microsystems Packaging: An Introduction Page 86 © 2003 Sandia National Laboratories Atmosphere, Hermeticity, Dew/Frost Point • Dew point inside package must be below minimum storage and operating temperature • No particles may enter the package and none may be generated during sealing • For some devices, the atmosphere will about 1atm (damping) and must be inert • Vacuum is required for other devices • Some concern that oxygen contributes to the wear of the surface micromachines Particles on comb drive Microsystems Packaging: An Introduction Page 87 © 2003 Sandia National Laboratories Ice on a Surface Micromachine • Dewpoint inside package must be below minimum storage/operating temperature • This micromachine did not run after this test Microsystems Packaging: An Introduction Page 88 © 2003 Sandia National Laboratories LID SEALING Belt Furnace Vacuum Sealing Microsystems Packaging: An Introduction Page 89 © 2003 Sandia National Laboratories Seam Sealing Final Test • Once package is assembled, need to test • Some devices may not be testable! – One-shot devices? – Microfluidic devices? – What then? • Also, must test during packaging process – How do you increase yield in packaging? • Hard questions to be addressed up front! Microsystems Packaging: An Introduction Page 90 © 2003 Sandia National Laboratories ADXL150 Accelerometer • Particles from de-lidding package • Space around chip to handle • Bond pads in from edge (what kind of bonds?) • Long bond wires not to my liking (resonances) Package MEMS Circuitry Wire Bond Epoxy Microsystems Packaging: An Introduction Page 91 © 2003 Sandia National Laboratories ADXL150 Chip View • MEMS in center, circuitry around it • Rough edge — cannot use for alig...
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This note was uploaded on 09/02/2010 for the course MEEN 5050 taught by Professor Himanshuj.sant during the Spring '10 term at University of Utah.

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