17a - Packaging or Chaos? Combined Packaging -Microfluidics...

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Packaging or Chaos? Combined Packaging -Microfluidics and Optics
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Fiber Optic to Waveguide Packaging • Self aligning tapers considered best method – Simplifies assembly Optical Interconnects
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“Microjoinery” MEMS Packaging Issues – Summary • If the MEMS devices is truly robust, the lowest-cost package may be from standard IC package types. • If the MEMS device is not quite robust enough to withstand injection molding, the gel coat method or some lower stress method may be employed. • To Package MEMS, there will be tradeoffs in terms of cost versus environmental resistance. • There will still be a requirement for custom form factors such as may be used to package non-electronic MEMS. • Best Packaging Method? – Cost – Simple
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Surface Micromachining / Standard MEMS Design Himanshu J. Sant Fundamentals of Microfabrication Gear Trains How do we make a gear that moves?
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Commercial MEMS Foundries • Sandia National Labs SUMMIT IV and V • MUMPS at MEMSCAP • Intellisense and others do custom
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17a - Packaging or Chaos? Combined Packaging -Microfluidics...

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