Lab 3 - Finite Difference Lab Handout 2006

Lab 3 - Finite Difference Lab Handout 2006 - Finite...

Info iconThis preview shows pages 1–2. Sign up to view the full content.

View Full Document Right Arrow Icon
Finite Difference Lab Spring 2006 You must work alone on this project. The first half of this lab, with some revisions, is from Incropera, F., and DeWitt, D., 2002, Introduction to Heat Transfer , John Wiley and Sons, New York. A major problem in packaging very large-scale integrated (VLI) circuits concerns cooling of the circuit elements. The problem results from increasing levels of power dissipation within the chip, as well as from packing chips closer together in a module. A novel technique for cooling multi-chip modules has been developed by IBM. Termed the thermal conduction module (TCM), the chips are soldered to a multiplayer ceramic substrate, and heat dissipated in each chip is conducted through a spring-loaded aluminum piston to a water-cooled cold plate. a) Consider a cold plate fabricated from aluminum (k=190 W/mK) with regularly spaced rectangular channels through which the water is passed. Under normal circumstances, power dissipation within the chips results in a uniform heat flux of q =1.00x10 5 W/m 2 at the base of the cold plate, while water flow provides a temperature of
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Image of page 2
This is the end of the preview. Sign up to access the rest of the document.

This note was uploaded on 09/08/2010 for the course ME 115 at San Jose State University .

Page1 / 2

Lab 3 - Finite Difference Lab Handout 2006 - Finite...

This preview shows document pages 1 - 2. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online