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ps3 - MIT OpenCourseWare http/ocw.mit.edu 2.830J 6.780J...

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MIT OpenCourseWare http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303) Spring 2008 For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms .
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Massachusetts Institute of Technology Department of Mechanical Engineering Department of Electrical Engineering and Computer Science 2.830J/6.780J Control of Manufacturing Processes Spring 2008 Assignment 3 Out 2/26/2008; due Tuesday 3/4/2008 Part 1 — qq plots and testing the assumption of normality A silicon wafer is patterned with an array of dies of identical design . When the wafer is cleaved to separate the dies, each die will become a single integrated circuit. Each die contains many MOSFETs that are wished to have identical dimensions. In reality, these dimensions vary within each die and the mean within-die dimension varies from die to die. A particular dimensional parameter of the MOSFETs produced in die 1 (near the edge of the wafer) is described by x 1 ~ N(0,1) and the same parameter of the MOSFETs in die 2 (near the wafer’s center) is described by x 2 ~ N( d ,1). A metrology expert presumes that die-to-die variability will be negligible in comparison with within-die
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