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MIT OpenCourseWare http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303) Spring 2008 For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms .
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Massachusetts Institute of Technology Department of Mechanical Engineering Department of Electrical Engineering and Computer Science 2.830J/6.780J Control of Manufacturing Processes Spring 2008 Assignment 1 Out 2/7/2008; due 2/14/2008 The goal of this assignment is to exercise the new perspective on manufacturing processes that you will gain from lectures 1–3. In problems 1 and 2 you will practice creating functional process models for processes that you may already be familiar with; in problem 3 you will explore sensitivity and variation in a particular semiconductor fabrication process. Problem 1 From the list of product components given below, please select one and do the following. (If you wish, you may substitute a product–process combination with which you are more familiar than with those on the list, but it should contain at least two discrete processing steps.) a) Determine the key quality characteristics that you would worry about if you were the customer for the part. In other words, what are the key measures of output geometry ( e.g . diameter) and of output constitutive properties ( e.g. hardness) for the part? (While aesthetic considerations might well be of concern to the customer, we are concerned here purely with measurable, functional outputs.) b) Based on the processes listed for your chosen component, describe how the component is made and what the principal determinants of the part’s geometry and its final constitutive properties will be. c)
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