lecture22 - MIT OpenCourseWare ____________...

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Unformatted text preview: MIT OpenCourseWare ____________ http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303) Spring 2008 For information about citing these materials or our Terms of Use, visit: ________________ http://ocw.mit.edu/terms . Modeling the embossing/imprinting of thermoplastic layers Hayden Taylor Microsystems Technology Laboratories Massachusetts Institute of Technology 8 May 2008 Hot micro- and nano-embossing Tool: Si/Ni/PDMS Part: PMMA, Polycarbonate, COC (Zeonex, Topas) t load t hold load temperature Glass-transition temperature time Applications: microfluidics, optics Thermal nanoimprint lithography (NIL): the process .Y. Chou et al., Appl. Phys. Lett. vol. 67 pp. 3114-3116, 1995 load temperature Glass-transition temperature time t load t hold Applications: sub-100 nm lithography Image removed due to copyright restrictions. Please see Fig. 1 in Chou, Stephen Y., et al. Imprint of sub-25 nm vias and Trenches in Polymers. Applied Physical Letters 67 (November 1995): 3114-3116. 4 t load t hold load temperature Glass-transition temperature To choose an optimal process, we need to assign values to Temperature, load, times Load and temperature are constrained by Equipment Stamp and substrate properties Our choice of substrate and pattern design are more or less constrained by the application time stamp polymer Hot micro- and nano-embossing Hot embossing: modeling aims How long to form a given set of features? How to improve pattern/process to reduce time or energy required? How to maximize uniformity of any residual layer? stamp stiff substrate polymer layer Non-uniformity occurs at three length scales Spatial non-uniformity Substrate- or machine-scale Device-scale; pattern-dependent Feature-scale R p polymer stamp chuck Workpiece-/machine-scale effects Spatial non-uniformity Substrate- or machine-scale Device-scale; pattern-dependent Feature-scale R p polymer stamp chuck Pressure variation Stamp/machine deflection Imperfect parallelism Chuck Compliant layer Plate Polymer Chuck Stamp/mold Chuck Polymer Stamp/mold Chuck Compliant layer Workpiece-/machine-scale effects Si PMMA...
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lecture22 - MIT OpenCourseWare ____________...

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